Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints

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Sn-3.5Ag solder reacted with heat-treated Cu films, and the characteristics of Kirkendall void formation at the Cu3Sn/Cu interface were investigated. Heat-treatment for the suppression of Kirkendall void formation in Sn-3.5Ag/Cu solder joints was conducted at varying temperature (T=400, 500 and 600 degrees C). The results showed that S segregation on the void surfaces were effectively suppressed by heat-treatment, and Kirkendall voiding at the Cu3Sn/Cu interface decreased as the heat-treatment temperature was increased. According to the solid solubility limit of sulfur in Cu, S in Cu film was in solid solution at all heat-treatment temperatures, so the amount of sulfur segregation was reduced. (C) 2013 Elsevier B.V. All rights reserved.
Publisher
ELSEVIER SCIENCE BV
Issue Date
2013-09
Language
English
Article Type
Article
Keywords

COPPER ELECTRODEPOSITION; ELECTROPLATED COPPER; ROOM-TEMPERATURE; GLYCOL; FILMS; CU

Citation

MATERIALS LETTERS, v.106, pp.75 - 78

ISSN
0167-577X
DOI
10.1016/j.matlet.2013.05.019
URI
http://hdl.handle.net/10203/194201
Appears in Collection
MS-Journal Papers(저널논문)
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