Browse by Subject CU
Showing results 1 to 60 of 116
| A new type of high entropy alloy composite Fe18Ni23Co25Cr21Mo8WNb3C2 prepared by mechanical alloying and hot pressing sintering Sun, Chongfeng; Li, Panpan; Xi, Shengqi; Zhou, Yun; Li, Shengwen; Yang, Xigang, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.728, pp.144 - 150, 2018-06 |
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| A superior catalyst with dual redox cycles for the selective reduction of NOx by ammonia Liu, Zhiming; Yi, Yang; Li, Junhua; Woo, Seong-Ihl; Wang, Baoyi; Cao, Xingzhong; Li, Zhuoxin, CHEMICAL COMMUNICATIONS, v.49, no.70, pp.7726 - 7728, 2013 |
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Atom probe tomography study of ultrahigh nanocrystallization rates in FeSiNbBCu soft magnetic amorphous alloys on rapid annealing Pradeep, KG; Herzer, G; Choi, Pyuck Pa; Raabe, D, ACTA MATERIALIA, v.68, pp.295 - 309, 2014-04 |
| Atomic layer deposition of nickel by the reduction of preformed nickel oxide Chae, Junghun; Park, Hyuong-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.5, no.6, pp.C64 - C66, 2002-06 |
| Atomic layer deposition of ruthenium thin films for copper glue layer Kwon, OK; Kim, JH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.2, pp.G109 - G112, 2004-01 |
| Attenuation of propagating spin wave induced by layered nanostructures Sekiguchi, K.; Vader, T. N.; Yamada, K.; Fukami, S.; Ishiwata, N.; Seo, S. M.; Lee, S. W.; et al, APPLIED PHYSICS LETTERS, v.100, no.13, 2012-03 |
| Bi2O3 as a Promoter for Cu/TiO2 Photocatalysts for the Selective Conversion of Carbon Dioxide into Methane Sunil, Jeong; Kim, Whi Dong; Lee, Sooho; Lee, Kangha; Lee, Seokwon; Lee, Dongkyu; Lee, Doh Chang, CHEMCATCHEM, v.8, no.9, pp.1641 - 1645, 2016-05 |
| Boosting Electrochemical CO2 Reduction to Methane via Tuning Oxygen Vacancy Concentration and Surface Termination on a Copper/Ceria Catalyst Patra, Kshirodra Kumar; Liu, Zhu; Lee, Hojeong; Hong, Seungwon; Song, Hakhyeon; Abbas, Hafiz Ghulam; Kwon, Youngkook; et al, ACS CATALYSIS, v.12, no.17, pp.10973 - 10983, 2022-09 |
| Calculation of surface tension and wetting properties of Sn-based solder alloys Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.297 - 302, 1999-01 |
| Chemical Control Of The Grain-Boundary Migration Of SrTiO3 in The SrTiO3-BaTiO3-CaTiO3 System Yoon, KJ; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.76, no.6, pp.1641 - 1644, 1993-06 |
| Cohesive failure of the Cu/polyimide system Park, IS; Ahn, EC; Yu, Jin; Lee, HY, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.282, no.1-2, pp.137 - 144, 2000-04 |
| Copper Seed Layer Deposition by a New Liquid Precursor Kang, Sang-Woo; Shin, Yong-Hyeon; Kim, Jin-Tae; Yun, Ju-Young; Chang, Yun-Hee; Yang, Il-Doo, CHEMICAL VAPOR DEPOSITION, v.17, no.1-3, pp.65 - 68, 2011-03 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
| Crystallization of amorphous WNx films Suh, BS; Cho, HK; Lee, YJ; Lee, WJ; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.89, no.7, pp.4128 - 4133, 2001-04 |
| Development of Pd-Cu/Hematite Catalyst for Selective Nitrate Reduction Jung, Sungyoon; Bae, Sung-Jun; Lee, Woojin, ENVIRONMENTAL SCIENCE & TECHNOLOGY, v.48, no.16, pp.9651 - 9658, 2014-08 |
| Discontinuous Dissolution of a Liquid Phase in Ba(Ni⅓Nb⅔)O₃ Ceramics j. k. park; d. y. kim; Yoon, Duk Yong, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.1, pp.218 - 220, 2001-01 |
| Dzyaloshinskii-Moriya interaction induced extrinsic linewidth broadening of ferromagnetic resonance Oh, Jung Hyun; Hong, Ik-Sun; Lee, Kyung-Jin, PHYSICAL REVIEW B, v.97, no.1, 2018-01 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| EFFECT OF ALUMINUM CONTENT ON THE ANODIC BEHAVIOR OF COPPER-ALUMINUM ALLOYS IN 3.5 WT-PERCENT NACL SOLUTION CHUN, YG; Pyun, Su Il; KIM, CH, MATERIALS LETTERS, v.20, no.5-6, pp.265 - 270, 1994-08 |
| Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12 |
| Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Choi, WK; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999 |
| Effects of (NH4)(2)SO4 and BTA on the nanostructure of copper foam prepared by electrodeposition Nam, Do-Hwan; Kim, Ryoung-Hee; Han, Dong-Wook; Kim, Jeong-Han; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.56, no.25, pp.9397 - 9405, 2011-10 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
| Effects of graphene oxide on the electromigration lifetime of lead-free solder joints Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02 |
| Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| Effects of platinum loading on the performance of proton exchange membrane fuel cells with high ionomer content in catalyst layers Ahn, Sang Hyun; Jeon, Sunyeol; Park, Hee-Young; Kim, Soo-Kil; Kim, Hyoung-Juhn; Cho, EunAe; Henkensmeier, Dirk; et al, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.38, no.23, pp.9826 - 9834, 2013-08 |
| Effects of SiO2 Addition in FePt on Microstructures and Magnetic Properties on Two Different MgO Substrates Byun, W. B.; Lee, Kyung-Jin; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.45, no.6, pp.2705 - 2708, 2009-06 |
| Effects of Solder Ball Geometry on Lap Shear Creep Rate Kim, Sung-Bum; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.3, pp.326 - 332, 2010-03 |
| Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
| Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
| Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10 |
| Effects of Zr addition on the phase stability of L1(2)-based Al-Ti-Cr alloys Chun, DH; Lee, JK; Oh, MH; Wee, Dang-Moon, MATERIALS LETTERS, v.59, no.23, pp.2923 - 2927, 2005-10 |
| Electrochemical analysis on the potential decay behavior of Fe-20Cr stainless steels in sulfuric acid solution Kim, YoungJun; Oh, Se-Kwon; Ahn, Soohoon; Oh, KkochNim; Jung, Ki Min; Kwon, HyukSang, ELECTROCHIMICA ACTA, v.266, pp.1 - 6, 2018-03 |
| Electrochemical carbon dioxide reduction on copper-zinc alloys: ethanol and ethylene selectivity analysis Baek, Yeji; Song, Hakhyeon; Hong, Deokgi; Wang, Suneon; Lee, Sungwoo; Joo, Young-Chang; Lee, Gun-Do; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.10, no.17, pp.9393 - 9401, 2022-05 |
| Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization Park, JH; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.93, no.2, pp.883 - 892, 2003-01 |
| Epitaxial Crystallization Behaviors of Various Metals on a Graphene Surface Kim, Dae Woo; Kim, Seon Joon; Choi, Hyung Ouk; Jung, Hee-Tae, ADVANCED MATERIALS INTERFACES, v.3, no.14, 2016-07 |
| Evaluation of Ag-doped (MnCo)(3)O-4 spinel as a solid oxide fuel cell metallic interconnect coating material Lee, Kunho; Yoon, Byoung Young; Kang, Juhyun; Lee, Sanghun; Bae, Joongmyeon, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.49, pp.29511 - 29517, 2017-12 |
| Fabrication of sintering-free flexible copper nanowire/polymer composite transparent electrodes with enhanced chemical and mechanical stability Chu, Cho Rong; Lee, Changsoo; Koo, Jahyun; Lee, Hyuck-Mo, NANO RESEARCH, v.9, no.7, pp.2162 - 2173, 2016-07 |
| Fabrication of superconducting MgB2 thin films on textured Cu(100) tape by hybrid physical-chemical vapor deposition Lee T.G.; Ranot M.; Seong W.K.; Jung S.-G.; Kang W.N.; Joo J.H.; Kim C.-J.; et al, SUPERCONDUCTOR SCIENCE & TECHNOLOGY, v.22, no.4, 2009 |
| Faceting of high-angle grain boundaries in titanium-excess BaTiO3 Cho, YK; Yoon, Duk Yong, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.87, no.3, pp.438 - 442, 2004 |
| Facile electrochemical synthesis of dilute AuCu alloy nanostructures for selective and long-term stable CO2 electrolysis Kim, Jaehoon; Song, Jun Tae; Oh, Jihun, JOURNAL OF CHEMICAL PHYSICS, v.153, no.5, 2020-08 |
| Fatigue of polymer-supported Ag thin films Sim, Gidong; Hwangbo, Yun; Kim, Hyun-Ho; Lee, Soon-Bok; Vlassak, Joost J., SCRIPTA MATERIALIA, v.66, no.11, pp.915 - 918, 2012-06 |
| Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08 |
| FIB-induced dislocations in Al submicron pillars: Annihilation by thermal annealing and effects on deformation behavior Lee, Subin; Jeong, Jiwon; Kim, You Bin; Han, Seung Min J.; Kiener, Daniel; Oh, Sang Ho, ACTA MATERIALIA, v.110, pp.283 - 294, 2016-05 |
| Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
| Glass formation in metallic Al-Ni-Y Kim, Young Kwan; Soh, Jeong Ryong; Kim, Do Kyung; Lee, HyuckMo, JOURNAL OF NON-CRYSTALLINE SOLIDS, v.242, no.2-3, pp.122 - 130, 1998-12 |
| Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints Kim, Sung-Hwan; Yu, Jin, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09 |
| High performance Mn1.3Co1.3Cu0.4O4 spinel based composite cathodes for intermediate temperature solid oxide fuel cells Thaheem, Imdadullah; Kim, Kyeong Joon; Lee, Jong Jun; Joh, Dong Woo; Jeong, Incheol; Lee, Kang Taek, JOURNAL OF MATERIALS CHEMISTRY A, v.7, no.34, pp.19696 - 19703, 2019-09 |
| High-temperature tensile behavior of freestanding Au thin films Sim, Gi-Dong; Vlassak, Joost J., SCRIPTA MATERIALIA, v.75, pp.34 - 37, 2014-03 |
| Highly conductive and stable Mn1.35Co1.35Cu0.2Y0.1O4 spinel protective coating on commercial ferritic stainless steels for intermediate-temperature solid oxide fuel cell interconnect applications Thaheem, I.; Joh, D.W.; Noh, T.; Lee, K.T., INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.44, no.8, pp.4293 - 4303, 2019-02 |
| Highly Efficient, Selective, and Stable CO2 Electroreduction on a Hexagonal Zn Catalyst Won, Da Hye; Shin, Hyeyoung; Koh, Jaekang; Chung, Jaehoon; Lee, Hee Sang; Kim, Hyungjun; Woo, Seong-Ihl, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.55, no.32, pp.9297 - 9300, 2016-08 |
| How to Directly Measure a Kondo Cloud's Length Park, Jinhong; Lee, Seung-Sup; Oreg, Yuval; Sim, Heung-Sun, PHYSICAL REVIEW LETTERS, v.110, no.24, pp.246603, 2013-06 |
| Improved TiN film as a diffusion barrier between copper and silicon Rha, SK; Lee, WJ; Lee, SY; Hwang, YS; Lee, YJ; Kim, DI; Kim, DW; et al, THIN SOLID FILMS, v.320, no.1, pp.134 - 140, 1998-05 |
| Insights on the work function of the current collector surface in anode-free lithium metal batteries Jung, Jinkwan; Kim, Ju Ye; Kim, Il Ju; Kwon, Hyeokjin; Kim, Gukbo; Doo, Gisu; Jo, Wonhee; et al, JOURNAL OF MATERIALS CHEMISTRY A, v.10, no.39, pp.20984 - 20992, 2022-10 |
| Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
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