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Showing results 85401 to 85420 of 109579
| Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산 박상희; 박중근, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000 |
| Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01 |
| Thermo-Elastic Analysis and Three-Dimensional Stress Analysis of Carbon/Carbon Brake Disk Oh, Se-Hee; Yoo, Jae-Seok; Kim, Chun-Gon; Hong, Chang-Sun; Kim, Kwang-Soo; Park, Jong-Hyun, The Third Korea-Japan Symposium of Composite Materials, pp.9 - 10, 2002-10 |
| Thermo-elastic Analysis of a Kick Motor Nozzle Incorporating Sptaially Reinforced Composites Yoo, JS; Lee, YM; Lee, SE; Kim, Chun-Gon, 5th International Congress on Thermal Stresses and Related Topics, 5th International Congress on Thermal Stresses and Related Topics, 2003-06 |
| Thermo-elastic Frictional Contact Analysis of an Aircraft Braking System KWAK BYUNG MAN, pp.889 - 894, 2001-06-01 |
| Thermo-Elasto-Plastic Finite Element Analysis of Quenching Process of Carbon Steel Kang, S.H; Im, Yong-Taek, The Seventh Asia Pacific Conference on Materials Processing, pp.70 -, APCMP, 2006-12-05 |
| Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing in Internal Combustion Engine Kim, BJ; Kim, Kyung-Woong, ASME/STLE International Joint Tribology Conference, 2000-10-01 |
| Thermo-Elastohydrodynamic Analysis of Connecting Rod Bearing: Application to Connecting Rod Bearing Design Kim, BJ; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2001-10-01 |
| Thermo-mechanical Analysis of Multi-layered Accident-tolerant fuel (ATF) Claddings 문지원; 류호진, 한국원자력학회 2023 춘계학술발표회, 한국원자력학회, 2023-05-18 |
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermo-mechanical Finite Element Analysis of Fuel Pellets Containing Lump Burnable Absorbers 김형진; 류호진, 한국원자력학회 2023 추계학술발표회, 한국원자력학회, 2023-10-26 |
| Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods Lee, Soon-Bok, SEM Fall Conference 2014, SEM Fall Conference 2014, 2014-10-21 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
| Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate 백경욱, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01 |
| Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates Paik, Kyung-Wook, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01 |
| Thermo-message: Exploring the potential of heat as a modality of peripheral expression Lee, Wonjun; Lim, Youn-kyung, 28th Annual CHI Conference on Human Factors in Computing Systems, CHI 2010, pp.4231 - 4236, ACM Special Interest Group on Computer-Human Interaction (SIGCHI), 2010-04-10 |
| Thermo-Optic Characteristics and Applications of the Sol-Gel Hybrid Material Films Bae, Byeong-Soo, The 5th International Meeting of Pacific Rim Ceramic Societies, 2003 |
| Thermo-optic tunable grating structure for coupler and radiator applications in silicon Kim, Seong-Hwan; Kim, Jong Hun; Yeo, Sanggu; Kang, Geumbong; Kim, Jeongyoon; Yoo, Dongeun; Lee, Harin; et al, SPIE Photonics West 2017, SPIE, 2017-02-01 |
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