Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 263
  • Download : 0
Issue Date
1998-04-01
Language
ENG
Citation

International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453

URI
http://hdl.handle.net/10203/118711
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0