Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Kim, JS | ko |
| dc.contributor.author | Oh, SH | ko |
| dc.contributor.author | Seo, HS | ko |
| dc.date.accessioned | 2013-03-15T10:36:02Z | - |
| dc.date.available | 2013-03-15T10:36:02Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-04-01 | - |
| dc.identifier.citation | International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/118711 | - |
| dc.language | English | - |
| dc.publisher | International Conference and Exhibition on Multichip Modules and High Density Packaging | - |
| dc.title | Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000073940900077 | - |
| dc.identifier.scopusid | 2-s2.0-34748819628 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 449 | - |
| dc.citation.endingpage | 453 | - |
| dc.citation.publicationname | International Conference and Exhibition on Multichip Modules and High Density Packaging | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Denver | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, JS | - |
| dc.contributor.nonIdAuthor | Oh, SH | - |
| dc.contributor.nonIdAuthor | Seo, HS | - |
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