Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection

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Publisher
IEEE 66th Electronic Components and Technology Conference
Issue Date
2016-06-01
Language
English
Citation

IEEE 66th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/209590
Appears in Collection
MS-Conference Papers(학술회의논문)
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