Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods
- Publisher
- SEM Fall Conference 2014
- Issue Date
- 2014-10-21
- Language
- ENG
- Citation
SEM Fall Conference 2014
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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