Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2015-01-29T05:26:49Z | - |
| dc.date.available | 2015-01-29T05:26:49Z | - |
| dc.date.created | 2014-12-24 | - |
| dc.date.issued | 2014-10-21 | - |
| dc.identifier.citation | SEM Fall Conference 2014, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/193405 | - |
| dc.language | ENG | - |
| dc.publisher | SEM Fall Conference 2014 | - |
| dc.title | Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | SEM Fall Conference 2014 | - |
| dc.identifier.conferencecountry | China | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
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