Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate

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Publisher
한국반도체 학술대회
Issue Date
1999-02-01
Language
KOR
Citation

제6회 한국반도체 학술대회, pp.269 - 272

URI
http://hdl.handle.net/10203/138015
Appears in Collection
MS-Conference Papers(학술회의논문)
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