Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article

Showing results 10081 to 10140 of 12024

10081

Thermally grown thin nitride films as a gate dielectric

Shin, Hresearcher; Choi, S; Hwang, T; Lee, Kwyroresearcher, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.33, pp.175 - 178, 1998-11

10082

Thermally stable fully silicided Hf-silicide metal-gate electrode

Park, CS; Cho, Byung Jinresearcher; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.6, pp.372 - 374, 2004-06

10083

Thermally stable optical characteristics of sol-gel hybrid material films

Moujoud, A; Kim, WS; Bae, Byeong-Sooresearcher; Shin, Sang Yungresearcher, APPLIED PHYSICS LETTERS, v.88, no.10, pp.228 - 236, 2006-03

10084

Thermally stable structure of InGaP/GaAs Hetero-junction Bipolar Transistor: Dual-emitter structure

Lee, You Sang; Park, Chul Soonresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.4B, pp.2658 - 2659, 2002-04

10085

Thermistor behavior of PEDOT:PSS thin film

Kwon, Il-Woong; Son, Hyuck-Jun; Kim, Woo-Young; Lee, Yong-Soo; Lee, Hee-Chulresearcher, SYNTHETIC METALS, v.159, no.12, pp.1174 - 1177, 2009-06

10086

Thermo-optic control of the longitudinal radiation angle in a silicon-based optical phased array

Kim, Seong-Hwan; You, Jong-Bum; Ha, Yungi; Kang, Geumbong; Lee, Daeseong; Yun, Hyunho; Yoo, Dong-Eun; et al, OPTICS LETTERS, v.44, no.2, pp.411 - 414, 2019-01

10087

Thermoelectric characteristics of Pt-silicide/silicon multi-layer structured p-type silicon

Choi, Won Chul; Jun, Dongseok; Kim, Soojung; Shin, Min-Cheolresearcher; Jang, Moongyu, ENERGY, v.82, pp.180 - 183, 2015-03

10088

Thermoelectric properties of P-type Sb2Te3 thick film processed by a screen-printing technique and a subsequent annealing process

Kim, Sun Jin; We, Ju Hyung; Kim, Jin Sang; Kim, Gyung Soo; Cho, Byung Jinresearcher, JOURNAL OF ALLOYS AND COMPOUNDS, v.582, pp.177 - 180, 2014-01

10089

Thermoelectric properties of screen-printed ZnSb film

Lee, Heon Bok; We, Ju Hyung; Yang, Hyun Jeong; Kim, Kukjoo; Choi, Kyung Cheolresearcher; Cho, Byung Jinresearcher, THIN SOLID FILMS, v.519, no.16, pp.5441 - 5443, 2011-06

10090

Thermofluorescent Conjugated Polymer Sensors for Nano- and Microscale Temperature Monitoring

Yarimaga, Oktay; Lee, Su-Mi; Ham, Dae-Young; Choi, Ji-Min; Kwon, Soon-Gyu; Im, Mae-Soon; Kim, Sung-Ho; et al, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.212, no.12, pp.1211 - 1220, 2011-06

10091

Thermooptic 2x2 asymmetric digital opticat switches with zero-voltage operation state

Noh, YO; Kim, JM; Yang, MS; Choi, HJ; Lee, HJ; Won, YHresearcher; Han, SG, IEEE PHOTONICS TECHNOLOGY LETTERS, v.16, no.2, pp.446 - 448, 2004-02

10092

Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

Kim, Cheol Ho; Kwon, Young-Seresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08

10093

Thickness dependent low-frequency noise characteristics of a-InZnO thin-film transistors under light illumination

Choi, Hyun-Sik; Jeon, Sanghunresearcher, APPLIED PHYSICS LETTERS, v.104, no.2, 2014-01

10094

THICKNESS UNIFORMITY AND ELECTRICAL-PROPERTIES OF ULTRATHIN GATE OXIDES GROWN IN N2O AMBIENT BY RAPID THERMAL-PROCESSING

Yoon, Giwanresearcher; JOSHI, AB; AHN, J; KWONG, DL, JOURNAL OF APPLIED PHYSICS, v.72, no.12, pp.5706 - 5710, 1992-12

10095

Thin Film Bulk Acoustic Resonators for RF Applications

Linh Mai; Jae-Young Lee; 윤기완researcher, 국제해양정보통신학회영문논문지, v.4, no.3, pp.111 - 113, 2006-09

10096

Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials

Kim, Eungtaek; Han, Yuncheol; Kim, Woohyun; Choi, Kyung Cheolresearcher; Im, Hyeon-Gyun; Bae, Byeong-Sooresearcher, ORGANIC ELECTRONICS, v.14, no.7, pp.1737 - 1743, 2013-07

10097

Thin film solar cells on honeycomb-structured substrates for photovoltaic building blocks

Baik, Seung Jae; Lee, Yong-Min; Lim, Koeng Suresearcher; Kim, Keun-Taek, RENEWABLE ENERGY, v.64, pp.98 - 104, 2014-04

10098

Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; Park, Junyong; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08

10099

Thin Ion-Gel Dielectric Layer to Enhance the Stability of Polymer Transistors

Lee, Sung Won; Shin, Minkwan; Park, Jae Yoon; Kim, Bong Soo; Tu, Deyu; Jeon, Sanghunresearcher; Jeong, Unyong, SCIENCE OF ADVANCED MATERIALS, v.7, no.5, pp.874 - 880, 2015-05

10100

Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices

Jung H.H.; Song J.; Nie S.; Jung H.N.; Kim M.S.; Jeong, Jae-Woongresearcher; Song Y.M.; et al, Advanced Materials Technologies, v.3, no.11, 2018-11

10101

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

10102

Thin PCB-Type Metamaterials for Improved Efficiency and Reduced EMF Leakage in Wireless Power Transfer Systems

Cho, Yeonje; Kim, Jonghoon; Kim, DongHyun; Lee, Seongsoo; Kim, Hongseok; Song, Chiuk; Kong, Sunkyu; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.353 - 364, 2016-02

10103

Thin-Film Thermoelectric Module for Power Generator Applications Using a Screen-Printing Method

Lee, Heon-Bok; Yang, Hyun Jeong; We, Ju Hyung; Kim, Kukjoo; Choi, Kyung Cheolresearcher; Cho, Byung Jinresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.40, no.5, pp.615 - 619, 2011-05

10104

Three Phase Resonant Pole Inverter Using a New Sepa Sated Soft Switching Resonant Pole

J.G.Cho; D.Y.Hu; G.H.Choresearcher, 전기학회논문지, v.4, no.2, pp.90 - 97, 1991

10105

Three phase three-level PWM switched voltage source inverter with zero neutral point potential

Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWooresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, no.5, pp.1320 - 1326, 2006-09

10106

Three-Dimensional Blood Vessel Quantification via Centerline Deformation

Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beomresearcher, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03

10107

Three-dimensional electro-floating display system using an integral imaging method

Min, SW; Hahn, Minsooresearcher; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06

10108

Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor

Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12

10109

Three-Dimensional Integration Approach to High-Density Memory Devices

Kim, Hojung; Jeon, Sanghunresearcher; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11

10110

Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate

Yeo, S. K.; Kwon, Young Seresearcher, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06

10111

Three-dimensional nanopillar-array photovoltaics on low-cost and flexible substrates

Fan, Zhiyong; Razavi, Haleh; Do, Jae-won; Moriwaki, Aimee; Ergen, Onur; Chueh, Yu-Lun; Leu, Paul W.; et al, NATURE MATERIALS, v.8, no.8, pp.648 - 653, 2009-08

10112

Three-dimensional quantum simulation of multigate nanowire field effect transistors

Shin, Mincheolresearcher, MATHEMATICS AND COMPUTERS IN SIMULATION, v.79, no.4, pp.1060 - 1070, 2008-12

10113

Three-dimensionally patterned Ag-Pt alloy catalyst on planar Si photocathodes for photoelectrochemical H-2 evolution

Lim, Sung Yul; Ha, Kyungyeon; Ha, Heonhak; Lee, Soo Youn; Jang, Min Seokresearcher; Choi, Mansoo; Chung, Taek Dong, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.21, no.8, pp.4184 - 4192, 2019-02

10114

Three-Electrode Metal-Oxide Gas Sensor System With CMOS Interface IC

Park, Jeong Ho; Park, Kwang Min; Kim, Tae-Wan; Shin, Seongheon; Park, Chong-Ookresearcher; Yoo, Hyung-Jounresearcher, IEEE SENSORS JOURNAL, v.17, no.3, pp.784 - 793, 2017-02

10115

Three-Level Capacitor Clamping Single Sustaining Driver With Dual Energy Recovery Path for Low Cost AC Plasma Display Panel

Choi, SW; Moon, GunWooresearcher, JOURNAL OF DISPLAY TECHNOLOGY, v.5, pp.398 - 407, 2009-10

10116

Three-level differential buffer for increasing noise margin in pseudo-differential signalling

Ha, K. -S.; Kim, Lee-Supresearcher; Bae, S. -J.; Park, K. -I.; Choi, J. S.; Jun, Y. -H., ELECTRONICS LETTERS, v.46, no.21, pp.1429 - 1430, 2010-10

10117

Three-Level Resonant Converter With Double Resonant Tanks for High-Input-Voltage Applications

Lee, Il-Oun; Cho, Shin-young; Moon, Gun-Wooresearcher, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.59, no.9, pp.3450 - 3463, 2012-09

10118

Three-stage clos-network switch architecture with buffered center stage for multi-class traffic

Kang, MK; Kyung, Chong-Minresearcher, JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, v.15, pp.263 - 276, 2006-04

10119

Three-stage model for robust real-time face tracking

Do, Jun-Hyeong; Bien, Zeung namresearcher, INTERNATIONAL JOURNAL OF IMAGING SYSTEMS AND TECHNOLOGY, v.17, no.6, pp.321 - 327, 2007

10120

Three-STEP HEURISTIC ALGORITHM FOR OPTIMAL PLA COLUMN FOLDING

YANG, YY; Kyung, Chong-Minresearcher, ELECTRONICS LETTERS, v.24, no.17, pp.1088 - 1090, 1988-08

10121

Three-STEP PIN ASSIGNMENT ALGORITHM FOR BUILDING BLOCK LAYOUT

CHOI, SG; Kyung, Chong-Minresearcher, ELECTRONICS LETTERS, v.28, no.20, pp.1882 - 1884, 1992-09

10122

Three-Switch Active-Clamp Forward Converter With Low Switch Voltage Stress and Wide ZVS Range for High-Input-Voltage Applications

Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWooresearcher; Youn, Myung Joongresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.25, pp.889 - 898, 2010-04

10123

Three-transistor one-time programmable (OTP) ROM cell array using standard CMOS gate oxide antifuse

Kim, J; Lee, Kwyroresearcher, IEEE ELECTRON DEVICE LETTERS, v.24, pp.589 - 591, 2003-09

10124

THRESHOLD BOOLEAN FILTERS

LEE, KD; Lee, Yong-Hoonresearcher, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.42, no.8, pp.2022 - 2036, 1994-08

10125

THRESHOLD SELECTION ALGORITHM FOR EXTRACTING A UNIFORM COLOR REGION IN AN IMAGE

CHANG, BH; Kim, Seong-Daeresearcher; Kim, Jae Kyoon, ELECTRONICS LETTERS, v.23, no.25, pp.1362 - 1363, 1987-12

10126

Threshold Voltage Tuning Technique in Gate-All-Around MOSFETs by Utilizing Gate Electrode With Potential Distribution

Park, Jun-Young; Bae, Hagyoul; Moon, Dong-Il; Jeon, Chang-Hoon; Choi, Yang-Kyuresearcher, IEEE ELECTRON DEVICE LETTERS, v.37, no.11, pp.1391 - 1394, 2016-11

10127

Threshold-based camera motion characterization of MPEG video

Kim, JG; Chang, HS; Kim, J; Kim, Hyung-Myungresearcher, ETRI JOURNAL, v.26, pp.269 - 272, 2004-06

10128

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

10129

Through-Silicon Via (TSV) Capacitance-Voltage (CV) Hysteresis Modeling for 2.5D and 3D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jounghyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.7, no.6, pp.925 - 935, 2017-06

10130

Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC

Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06

10131

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Horesearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09

10132

Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations

Kim, Tae-Joon; Lim, Jong-Taeresearcher, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03

10133

THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX

KIM, SR; Un, Chong-Kwanresearcher, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11

10134

THROUGHPUT ANALYSIS OF CHANNEL LOAD SENSE MULTIPLE ACCESS WITH OVERLOAD DETECTION PROTOCOL IN SPREAD SPECTRUM PACKET RADIO NETWORKS

LIM, DM; Lee, Hwang Sooresearcher, ELECTRONICS LETTERS, v.27, no.20, pp.1809 - 1810, 1991-09

10135

Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism

Lee, IG; Yoo, Hyung Jounresearcher; Park, Sin Chongresearcher, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.1, pp.402 - 407, 2005-01

10136

Throughput and Delay Performance of DSL Broadband Access with Cross-Layer Dynamic Spectrum Management

Tsiaflakis, Paschalis; Yi, Yungresearcher; Chiang, Mung; Moonen, Marc, IEEE TRANSACTIONS ON COMMUNICATIONS, v.60, no.9, pp.2700 - 2711, 2012-09

10137

Throughput Characteristics by Multiuser Diversity in a Cognitive Radio System

Hong, Jun-Pyo; Choi, Wanresearcher, IEEE TRANSACTIONS ON SIGNAL PROCESSING, v.59, no.8, pp.3749 - 3763, 2011-08

10138

Throughput Efficiency of LAPB/D Protocol with Multi-Reject Error Recovery Procedure

W.Y.Jung; C.K.Unresearcher, ELECTRONICS LETTERS, v.25, no.19, pp.1318 - 1320, 1989-09

10139

Throughput enhancement scheme in an OFCDM system over slowly-varying frequency-selective channels

Chang, K; Han, Youngnamresearcher, INFORMATION NETWORKING: CONVERGENCE IN BROADBAND AND MOBILE NETWORKING BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.3391, pp.697 - 706, 2005

10140

Throughput Estimation of Downlink Packet Access Systems Based on a Point Mass Approximation Concept

Kim, Junsu; Moon, Sung Ho; Sung, Dan Keunresearcher, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.59, no.7, pp.3356 - 3363, 2010-09

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