Browse "College of Engineering(공과대학)" by Author 1094
Showing results 93 to 152 of 162
| Low noise THz Emitter Using Lift-off LT-GaAs Thin Film Sitch on Fused Silica Kim, Joungho; Baek, Seungyong; Lee, Jongjoo; Ryu, Jaeyoung; Jung, Yuchul; Lee, Heeseok, International Terahertz workshop 2000, 2000 |
| Measurement of Picosecond Pulse Propagation Characteristics on Coplanar Transmission Lines Kim, Joungho; Lee, Jongjoo; Yu, S., 5th IEEE Workshop on Signal Propagation on Interconnects, IEEE, 2001 |
| Methodology to Generate Frequency Domain Specifications from Eye Masks using Statistical Analysis Kim, Joungho; Kim, Nam Hoon; Yi, Ju Hwan; Lee, Eric; Sung, Baegin; Hwang, Seung Ho, DesignCon 2007, 2007 |
| Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; et al, IMAPS 2000, 2000 |
| Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
| Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
| Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
| Microwave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection 김정호; 백경욱, 제6회 한국반도체 학술대회, pp.621 - 622, 한국반도체 학술대회, 1999-02 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and Verification to Analyze Effect of Power/Ground Noises on CMOS Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae; Shim, Jongjoo, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Modeling of Chip Level Power Distribution Network Based on Segmentation Method Kim, Joungho; Kim, Jaemin; Shim, Yujeong; Song, Eakhwan; Koo, Kyungchul, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Multi-Chip Module (MCM) RF Transceiver For 1.8 GHz Cellular Phone Kim, Joungho; Kim, Namhoon; Ryu, Woonghwan; Kim, Jonghoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, APACK99, Symposium on Advances in packaging, pp.440 - 443, 1999-12 |
| Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package Kim, Joungho; Pak, Jun So; Ryu, Chunghyun, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications Choi, J.; Kam, D.G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, Joungho; Swaminathan, M., 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.69 - 72, IEEE, 2005-10-24 |
| Network-on-Chip and Network-in-Package for High-Performance SoC Kim, Joungho; Lee, Kangmin; Lee, Se-Joong; Kim, Donghyun; Kim, Kwanho; Kim, Gawon; Yoo, Hoi-Jun, IEEE 1st Asian-Solid State Circuits Conference, pp.485 - 488, 2005-11 |
| Novel High-impedance photoconductive sampling probe for ultra-high speed circuit characterization Kim, Joungho; Chan, Y. J.; Williamson, S.; Nees, J.; Wakana, S.; Whitaker, J.; Pavlidis, D., Technical Digest of 1992 IEEE GaAs IC Symposium, pp.19 - 22, 1992 |
| Novel time domain picosecond pulse sampling system for non-contact characterization of liquids, semiconductors, and metals Kim, Woopoung; Ryu, Jaeyoung; Lee, Heeseok; Kim, Joungho, Proceedings of the 1999 Pacific Rim Conference on Lasers and Electro-Optcis (CLEO/PACIFIC Rim '99), v.3, pp.791 - 792, 1999-08-30 |
| On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via) Park, Junso; Kim, Joungho, 2009 Korea-Japan Joint Conference, pp.139 - 142, IEEE, 2009-05-14 |
| On-Wafer Pump-Probe Photoconductive Sampling for Millimeter Wave Passive Device Testing Kim, Joungho; Lee, J; Lee, HS, 5th International Workshop on Femtosecond Technology, 1998-02 |
| Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls Ahn, Seung Young; Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woo Poung; Paik, Kyung-Wook; et al, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425, 1999-10-18 |
| Over Giga Hertz Digital Interconnects Using Anisotropic Conductive Film(ACFs)Flip-Chip Kim, Joungho, , 1999 |
| Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling Chung, Daehyun; Kim, Hyungsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.30 - 32, IEEE, 2003-12-12 |
| Photoconductive Sampling Using Phase Retrieval algorithm Kim, Joungho; Kim, WP; Lee, JJ, Inter. Topical Workshop on Contemporary Photonics Technology231, 1998-01 |
| Picosecond characteristics of velocity overshoot in GaAs up to 200 kV/cm Kim, Joungho; Son, J.; Hsa, W.; Norris, T. B.; Whitaker, J. F.; Mourou, G. A., Quantum Electronics and Laser Science conference, pp.152 - 152, 1993 |
| Picosecond Detector, Optical Temporal Analyzer, and Free-Standing Circuit Probe Kim, Joungho; Nees, J.; Williamson, S.; Gupta, S., Ultrafast Electronics and Optoelectronics, pp.186 - 188, 1993-01 |
| Picosecond Pulse Propagation Measurement on CPW Using A Photoconductive Near-Field Probe Kim, Joungho; Lee, Jongjoo, 2th MINT Milimeter-wave International, pp.109 - 112, 2001 |
| Picosecond Time-Domain Characterization of Millimeter-Wave Antenna Using Fiber-Coupled Photoconductive Probe Antenna Kim, Joungho; Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Ryu, Jaeyoung, Korea-China Joint Symposium on Semiconductor Physics and device Applications, pp.57 - 59, 1999-09-13 |
| Picosecond Time-Domain Photoconductive Sampling Method For Measuring Guided and Free-Space Pulse Propagation Kim, Joungho; Ryu, Jaeyoung; Lee, Jongjoo; Lee, Heeseok; Kim, Woopoung, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999 |
| Power/Ground Noise Mitigation Using Z-shape Partial Electromagnetic Bandgap (ZP-EBG) Structure for Ultra-Wideband (UWB) System Kim, M; Yoon, C; Lee, W; Sung, H; Kim, Joungho, 2010 Asia-Pacific Radio Science Conference, 2010 Asia-Pacific Radio Science Conference, 2010-12-30 |
| Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines Kim, G.; Song, E.; Kim, Ji Seong; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| Precise Analysis and Modeling of Far-end Crosstalk using Mode Analysis in Coupled Microstrip Lines Kim, Joungho; Kim, Gawon; Song, Eakhwan; Kim, Jiseong, Electrical Design Advanced Packaging & Systems, EDAPS 2009, 2009 |
| Quarter-Circle Shaped Plane Cavity Resonator for Skew-Free and Low Jitter Clock Distribution Network Kim, Joungho; Lee, Woojin; Ryu, Chunghyun; Park, Jongbae, Presented at Proceeding of XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| Radiated Electromagnetic Interference (EMI) Suppression from Plasma Display Panel by using Filtering Method based on Measurements Kim, Joungho; Lee, Heejae; Pak, Jun So; Shin, Minchul; Park, Hyunjeong; Shim, Jongjoo; Kim, Gawon; et al, 2009 Korea-Japan Joint Conference, pp.223 - 226, 2009 |
| Recent advances in electromagnetic compatibility of 3D-ICS - Part II Sicard, Etienne; Jianfei, Wu; Shen, Rongjun; Li, Er-Ping; Liu, En-Xiao; Kim, Joungho; Cho, Jeong-Hyeon; et al, IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74, 2016 |
| Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence Kim, Joungho; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003 |
| Reduction of RF-coils Loading Effects on Quadrature Coupler of 3-T MRI using 4-port Network Analysis Kim, Joungho; Ryu, WH; Sung, MH; Kim, HS; Lee, HK, Sixth Meeting of the Inter. Society for Magnetic Resonance, 1998-04 |
| RF Interconnect for Multi-Gbit/sec Board-Level Clock Distribution Kim, Joungho; Ryu, Woonghwan; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Namhoon; Choi, Baekkyu, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999-10 |
| RF Phenomena in High-Speed VLSI Interconnections 김정호; 김형수; 류웅환; 김종훈, Semicon Korea, 1998-01 |
| Separation of Reflections and Noises from THz measurement Using Independent Component Analysis (ICA) Kim, Joungho; Jung, Youchul; Ryu, Jaeyoung; Lee, Jongjoo; Baek, Seungyong, International Terahertz workshop 2000, 2000 |
| Seperated Role of On-chip and On-PCB Decoupling Capacitors on reduction of radiated Emission on Printed Circuit Board Kim, Joungho; Kim, Jonghoon; Choi, Baekyu; Kim, Hyungsoo; Ryu, Woonghwan; Yun, Younghwan; Ham, Seog-heon; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, IEEE, 2001 |
| Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12 |
| Solution Space Analysis of Interconnects for Low voltage Differencial Signaling(LVDS)Applications Kim, Joungho; Ahn, S; Lu, A C W.; Fan, W; Wai, L L, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP2001), pp.297 - 330, 2001 |
| Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system Kim, J.; Kam, D.G.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.3, pp.820 - 825, IEEE, 2004-08-09 |
| Suppression of radiated emission from an 8-bit micro-controller using gate-oxide filtering capacitors Kim, Hyungsoo; Kim, Jonghoon; Ryu, Woonghwan; Sung, Myunghee; Ahn, Seungyoung; Kim, Joungho, Proceedings of the 1999 IEEE EMC Symposium on 'Electromagnetic Compatibility', v.2, pp.811 - 815, IEEE, 1999-08-02 |
| Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002 |
| Terahertz Optoelectoonics: Applications using Photoconductive sampling 김정호; 이종주; 이희석; 김우평; 이재훈, '98 Femtosecond Science and Technology Workshop, 1998-02 |
| Terahertz Radiation Image from Photoconductive Dipole Antenna Kim, Joungho; Lee, H; Lee, J, Inter. Topical Works. on Contemporary Photonics Tech., 1998-01 |
| Terahertz Technology and applications Kim, Joungho, International Meeting on Optoelectronics and Photonic Instrumentation, 1999-12 |
| The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Time-domain Network Analysis of MM-wave Circuits Based on a Photoconductive Probe Sampling technique Kim, Joungho; Son, J.; Wakana, S.; Nees, J.; Williamson, S.; Whitaker, J.; Kwon, Y.; et al, 1993 IEEE MTT-s Digest, pp.1359 - 1362, 1993 |
| Transient Response of Terahertz Emitter using Finite-Difference Time-Domain (FDTD) Method Kim, Joungho; Lee, Heeseok; Lee, Jaehoon, The Sixth IEEE International Conference on Terahertz Electronics, pp.208 - 210, 1998-09 |
| TSV modeling and noise coupling in 3D IC Kim, Joungho; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13 |
| Ultrafast Single Mode Pulse Propagation on CPW with Air-bridges Observed by Photoconductive Pump-Probe Measurement Kim, Joungho; Lee, Jongjoo, SPIE Workshop on Terahertz and Gigahertz Photonics, pp.295 - 302, 1999-07 |
| Ultrafast/Terahertz Optoelectronics Kim, Joungho, , 1997-09 |
| Unit Cell Modeling of Interconnect Isolated by Metal-filled Via Array for High Crosstalk Immunity Kim, Joungho; Lee, Heeseok; Park, Bongcheol; Kam, Dong Gun, IEEE 6th Workshop on Signal Propagation on Interconnects, pp.41 - 43, IEEE, 2002 |
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