Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)

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Issue Date
2009-12-02
Language
ENG
Citation

2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009

URI
http://hdl.handle.net/10203/154033
Appears in Collection
EE-Conference Papers(학술회의논문)
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