Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, C. | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.contributor.author | Kim, J. | - |
| dc.date.accessioned | 2013-03-19T00:27:42Z | - |
| dc.date.available | 2013-03-19T00:27:42Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-12-02 | - |
| dc.identifier.citation | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/154033 | - |
| dc.language | ENG | - |
| dc.title | Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-77950199939 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 | - |
| dc.identifier.conferencecountry | Hong Kong | - |
| dc.identifier.conferencecountry | Hong Kong | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Yoon, C. | - |
| dc.contributor.nonIdAuthor | Kim, J. | - |
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