Recent advances in electromagnetic compatibility of 3D-ICS - Part II
This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via (TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.
- Issue Date
- 2016
- Language
- English
- Citation
IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74
- ISSN
- 2162-2264
- Appears in Collection
- EE-Journal Papers(저널논문)
- Files in This Item
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