Recent advances in electromagnetic compatibility of 3D-ICS - Part II

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This second part addresses a selection of topics related to Electromagnetic interference (EMI) issues in three-dimensional integrated components. Details about Through Silicon Via (TSV) technology, modelling and parasitic effects are introduced in the first part, then key concepts such as signal integrity (SI), power integrity (PI), and Electromagnetic Interference are introduced.
Publisher
Institute of Electrical and Electronics Engineers Inc.
Issue Date
2016
Language
English
Citation

IEEE Electromagnetic Compatibility Magazine, v.5, no.1, pp.65 - 74

ISSN
2162-2264
DOI
10.1109/MEMC.2016.7477137
URI
http://hdl.handle.net/10203/222909
Appears in Collection
EE-Journal Papers(저널논문)
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