Microwave frequency model of water level package and increased loading effect on rambus memory module

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Issue Date
2001-05-29
Language
ENG
Citation

51st Electronic Components and Technology Conference, pp.128 - 132

ISSN
0569-5503
URI
http://hdl.handle.net/10203/126609
Appears in Collection
EE-Conference Papers(학술회의논문)
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