Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Taek-Soo
Showing results 1 to 60 of 134
| A highly sensitive, flexible capacitive pressure sensor based on porous dielectric elastomer Kwon, Donguk; Lee, Tae-ik; Amjadi, Morteza; Kim, Seunghwan; Kim, Min Seong; Kim, Taek-Soo; Park, Inkyu, MNE 2014, MNE 2014, 2014-09-25 |
| A Study on Intrinsic Mechanical Propeties of n-type Conjugated Polymer via Controlling the Molecular Weight : The Importance of Critical Molecular Weight for Stretchable Organic Electronics Choi, Joonhyeong; Kim, Wansun; Kim, Taek-Soo; Kim, Bumjoon J, 2019 APS Physics MARCH meeting, APS, 2019-03-04 |
| A Study on Mechanical properties of Thinned Single Crystal Silicon Wafer: Effect of Size and Direction Lee, Sangmin; Kim, Jae Han; Ohba, T; Kim, Y-S; Kim, Taek-Soo, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, The Japan Institute of Electronics Packaging, 2018-04-20 |
| A study on rate-dependent mechanical transfer of synthesized multilayer graphene considering crack deflection effect Kang, Sumin; Yoon, Taeshik; Kim, Taek-Soo, The 16th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2017-10-19 |
| A Versatile Hydrogel-laden Paper Scaffold System for Origami-based Tissue Engineering Kim, S.-H; Lee, HR; Yoo, J; Han, M; LEE, TAE-IK; Kim, Taek-Soo; Kwon, S; et al, 2015 KSBB Spring Meeting and International Symposium, 한국생물공학회, 2015-04-16 |
| Adhesion and tensile characteristics of solution-processed Ag nanoparticle thin films Kim, S.; Won, S.; Lee, I.; Kim, Taek-Soo; Lee, Soon-Bok; Park, Inkyu, 2012 MRS Fall Meeting, MRS, 2012-11-25 |
| Adhesion Characteristic of Graphene Synthesized on Cu Yoon, T.; Shin, W.C.; Mun, J.H.; Cho, Byung Jin; Kim, Taek-Soo, Materials Research Society Fall Meeting, Materials Research Society (MRS), 2013-12-01 |
| Adhesion Energy and Etching-Free Renewable Transfer of Graphene As-Grown on Copper Yoon, Taesik; Shin, Woo Cheol; Kim, Taek Yong; Mun, Jeong Hun; Cho, Byung Jin; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers Kim, Sanwi; Kim, Taek-Soo, 67th IIW International Conference, IIW, 2014-07-17 |
| Adhesion of Advanced Thin Films Kim, Taek-Soo, The 7th International Conference on Technological Advances of Thin Films & Surface Coatings, Thin Film Society, 2014-07-15 |
| Adhesion of Silver Ion Ink Films on Flexible Substrates Choi, H; Kim, Jae Han; Kim, Taek-Soo, ACEM2016, ACEM, 2016-11-16 |
| Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics Kim, S.; Kim, Taek-Soo, International Workshop on Advanced Packaging & System Technology, Advanced Packaging & System Technology, 2012-11-22 |
| Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics Kim, Sanwi; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Adhesion Reliability of Advanced Thin Films Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
| Aliphatic spacer embedded polymer donors enable superior blend miscibility for high-performance and mechanically-robust polymer solar cells Kim, Jinseck; Lee, Jin-Woo; Jeong, Dahyun; Kim, Dongjun; Kim, Taek-Soo; Kim, Bumjoon J., Global Photovoltaic Conference 2022, GPVC 2022, Korea Photovoltaic Society (KPVS), 2022-07-06 |
| Annealing-induced interfacial fracture energy of silver nanoparticle films on substrate for reliable printed electronics Lee, Inhwa; Kim, Sanghyeok; Yun, J.; Park, Inkyu; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Bonding Reliability of Silver Nanoparticles Lee, I; Kim, S; Yoon, J; Park, I; Kim, Taek-Soo, KSPE 2011 Autumn Conference, KSPE, 2011-10-27 |
| Characterization of Metal Electrode Corrosion on Ionic Polymer Kim, Junmo; Pyo, Jae-Bum; Kim, Taek-Soo, 2018 - Emerging Technologies in Mechanical Engineering, The Korean Society of Mechanical Engineers (KSME), 2018-08-21 |
| Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation Yeap, K.B.; Hangen, U; Ritz, Y; Kim, Taek-Soo; Dauskardt, R.H.; Zschech, E, Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop, pp.159 - 165, Proceedings of Stress-Induced Phenomena in Metallization, 2010-01-01 |
| Comparative Study of Decohesion and Tensile Properties of All-Polymer and Fullerene-Polymer Solar Cells Choi, Joonhyeong; Kim, Wansun; Kim, Jae-Han; Kim, Taesu; Lee, Changyeon; Lee, Seungjin; Kim, Mingoo; et al, The 7th Pacific Rim Conference on Rheology, The Korean Society of Rheology, 2018-06-10 |
| Controlled Multiple Neutral Planes by Low Elastic Modulus Adhesive Kim, Wansun; Lee, Inhwa; Kim, Taek-Soo, ACEM2016, ACEM, 2016-11-16 |
| Controlled rolling of thin films for tubular structures with superior mechanical properties Kang, Sumin; Pyo, Jae-Bum; Kim, Taek-Soo, 18th International Conference on Experimental Mechanics, European society for experimental mechanics, 2018-07-04 |
| Damage-Free and Selective Transfer of Ultra-Thin Films by Solvent Assisted Adhesion Control Kang, Sumin; Ma, Boo Soo; Yoon, Taeshik; Cho, Min Sun; Kim, Taek-Soo, 2019 MRS Fall Meeting & Exhibit, Materials Research Society, 2019-12-02 |
| Design of Conducting-Polymer-Free Highly Flexible Organic Light Emitting Diodes Having Oxide-Based Thin Film Encapsulation Layers. Kim, Eungjun; Yoo, Seunghyup; Choi, Kyung Cheol; Kim, Taek-Soo; Kwon, Jeong Hyun; Kim, Cheolgyu, The 2018 MRS Fall Meeting & Exhibit, Materials Research Society, 2018-11-26 |
| Design of Highly Flexible Organic Light Emitting Diodes Having Oxide-Based Transparent Electrodes and Thin Film Encapsulation layers. Kim, Eungjun; Yoo, Seunghyup; Choi, Kyung Cheol; Kim, Taek-Soo; Kwon, Jeong Hyun; Kim, Cheolgyu, The 12th International Conference on Electroluminescence and Optoelectronic Devices (ICEL 2018), Seoul National University, 2018-10-15 |
| Desolvation-Triggered Versatile Transfer-Printing of Binder-free Boron Nitride Films with Thermal-Optical Dual Functionality Han, Yujin; Han, Hyeuk Jin; Kim, Cheolkyu; Kim, Moohyun; Lim, Hunhee; Jang, Hanhwi; Cho, Eugene; et al, International Meeting on Information Display 2021, The Korean Information Display Society, 2021-08-26 |
| Detection of cracks in graphene by scattering parameter measurements KANG, TAE YEOB; Seo, D; Yoon, Taeshik; Kang, Sumin; Kim, Taek-Soo, Carbon 2017, Royal Australian Chemical Institute, 2017-07-26 |
| Development of inclined conductive bump (ICB) for flip-chip interconnection Park A.-Y.; Kim S.-R.; Yoo C.D.; Kim, Taek-Soo, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885, ECTC, 2011-05-31 |
| Development of Inclined Conductive Bump for Electronic Packaging Park, A; Kim, S; Yoo, C; Kim, Taek-Soo, KSPE 2011 Spring Conference, KSPE, 2011-06-01 |
| Development of Quantitative Adhesion Measurement Method for SOFC Kim, S.; Yoon, K.J.; Son, J.-W.; Kim, Taek-Soo, The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015, Nano Korea, 2015-07-01 |
| Development of Thin Gold Film Tensile Testing by Floating Specimen on Water Surface Kim, J.; Nizami, A.; Lee, H.; Woo, C.; Hyun, S.; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Direct Measurement and Enhancement of Adhesion Energy of Bi-Te Thermoelectric Thin Films Kim, C.; Jeon, S.; Lee, H.; Hyun, S.; Kim, Taek-Soo, The Electrochemical Society Meeting, ECS, 2012-10-07 |
| Donor-acceptor alternating copolymer-type compatibilizer affords high efficiency, thermal stability, and mechanical robustness of organic solar cells Lee, Jin-Woo; Sun, Cheng; Kim, Dong Jun; Kim, Taek-Soo; Kim, Yun-Hi; Kim, Bumjoon J., ACS Spring 2022, American Chemical Society, 2022-03-20 |
| Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, 2017 International Conference on Electronics Packaging, ICEP 2017, pp.566 - 567, Institute of Electrical and Electronics Engineers Inc., 2017-04-19 |
| Effect of Donor/Acceptor Blend Ratio and Molecular Weight of Polymer Acceptor on Fracture Behavior of All-Polymer Solar Cells Ma, Boo Soo; Lee, Jin-Woo; Kim, Bumjoon J.; Kim, Taek-Soo, International Conference on Materials and Reliability, The Korean Society of Mechanical Engineers, 2019-11-28 |
| Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ju, Min Sang; Kim, Taek-Soo, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, IEEE, 2023-06-02 |
| Effect of Moisture Absorption on the Warpage of Flexible Polymer Substrates Pyo, JB; Lee, TI; Kim, C; Kim, MS; Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Effect of the acceptor types on the fracture behavior of polymer solar cells Kim, Wansun; Choi, Joonhyeong; Kim, Jae-Han; Kim, Taesu; Lee, Changyeon; Lee, Seungjin; Kim, Mingoo; et al, 2018 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12-19 |
| Effect of UV/Ozone Treatment on Interfacial Adhesion of Multilayer Graphene Seo, J; Kim, Taek-Soo, The 7th International Conference on Technological Advances of Thin Films & Surface Coatings, Thin Film Society, 2014-07-15 |
| Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environment Kim, Jihye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2319 - 2325, IEEE-CPMT, 2018-05-31 |
| Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2161 - 2167, IEEE-CPMT, 2017-06-01 |
| Effects of Hydrophobic Agent Content in Macro-Porous Substrates on the Fracture Behavior of the Gas Diffusion Layer for PEMFC Kim, S.; Jeong, B.-H.; Hong, B.K.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-16 |
| EFFICIENT, GREEN-SOLVENT PROCESSED, AND MECHANICALLY ROBUST POLYMER SOLAR CELLS ENABLED BY HYDROPHILIC SPACER-INCORPORATED POLYMER DONORS Lee, Seungjin; Lim, Chulhee; Lee, Jin-Woo; Lee, Sun-Woo; Jeon, Yeonji; Kim, Taek-Soo; Lee, Jung-Yong; et al, Global Photovoltaic Conference 2022, GPVC 2022, Korea Photovoltaic Society (KPVS), 2022-07-06 |
| Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics Oh, Seung Jin; Choi, Kyung Cheol; Kwon, Jeong Hyun; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Elucidating Thickness-Dependent Plane Stress Fracture Toughness of Ultra-Thin Nanocrystalline Gold Films Song, Myoung; Ma, Boo Soo; Oh, Seung Jin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition Oh, Seung Jin; Lee, Sun-Woo; Ham, Yeong Seok; Kwon, Jeong Hyun; Kim, Taek-Soo, The 14th International Symposium on NDT in Aerospace (AeroNDT2023), The Korean Society of Mechanical Engineers, 2023-11-08 |
| Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sung Woo; Jeong, Mu-Hyeon; Lee, Jin Hee; Lee, Woong-Sun; et al, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Etching-Free Mechanical Transfer and Adhesion Measurement of Multilayer Graphene As-Grown on Nickel Kang, Sumin; Yoon, Taeshik; Kim, Taek-Soo, The 15th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate Ko, Yongho; Kim, Taek-Soo; Lee, Changwoo, TMS 2014 143rd Annual Meeting, The Minerals, Metals & Materials Society(TMS), 2014-02-16 |
| Evaluation on Property and Reliability of Micro-bump Joint between Si chip and Flexible Substrate Ko, Y.; Kim, M.; Kim, Taek-Soo; Bang, J.; Lee, C., 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging, 2013-10-06 |
| Experimental Verification of Through-Thickness Strain Distribution in Flexible Devices Under Bending Lee, Tae-Ik; Kim, Wansun; Jo, Woosung; Kim, Jihye; Paik, Kyung-Wook; Kim, Taek-Soo, 18th International Conference on Experimental Mechanics, European society for experimental mechanics, 2018-07-01 |
| Exploiting DMSO to Enhance Mechanical and Electrical Properties of PEDOT:PSS Conducting Polymer Films Lee, Inhwa; Kim, G.W; Yang, Min-Yang; Kim, Taek-Soo, Materials Research Society 2015 Spring Meeting, Materials Research Society, 2015-04-08 |
| Fabrication of Hydrogel-laden Paper Scaffolds for Tissue Regeneration Yu, Seung Jung; Kim, Suwhan; 이학래; Kim, Taek-Soo; 권성근; 황석연; Im, Sung Gap, 2016 춘계 한국생체재료학회, 한국생체재료학회, 2016-03-25 |
| Fabrication of Robust Freestanding Gold Membrane by Heat Treatment Kim, Dong Jun; Kim, Yong Hwi; Kim, Taek-Soo, Advanced Epitaxy for Freestanding Membranes and 2D Materials Conference, AEFM 2023, AEFM, 2023-07-10 |
| FE Analysis of Three-Layered Biomimetic Skin Pad for Prosthetic Hands Heo, Si-Hwan; Kim, Cheolgyu; Kim, Dong Hyun; Kim, Taek-Soo; Park, Hyung-Soon, 10th International Symposium on Nature-Inspired Technology, 대한기계학회, 2017-06-29 |
| FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, 2017 International Conference on Electronics Packaging, ICEP 2017, pp.422 - 423, Institute of Electrical and Electronics Engineers Inc., 2017-04-21 |
| Flexibility analysis of thin film encapsulation with structural variation Hyunjeong Shim; Kim, Cheolgyu; Kim, Bong Jun; Young-il Lee; Boo Soo Ma; Kim, Taek-Soo; Im, Sung Gap, IMID 2017, IMID 2017, 2017-08-31 |
| Flexible-linker embedded polymer donors enable superior blend miscibility for high-performance and mechanically-robust polymer solar cells Lee, Jin-Woo; Jung, Dahyun; Kim, Dong Jun; Kim, Taek-Soo; Kim, Bumjoon J., ACS Spring 2022, American Chemical Society, 2022-03-20 |
| Flexural Modulus Measurement and Warpage Analysis of Multilayers on Polymer Composite Substrates for Flexible Electronics Lee, TI; Kim, C; Kim, MS; Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Floating Transfer of Residual-Free Graphene using Water Surface J. Seo; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15 |
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