A Study on Mechanical properties of Thinned Single Crystal Silicon Wafer: Effect of Size and Direction

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Publisher
The Japan Institute of Electronics Packaging
Issue Date
2018-04-20
Language
English
Citation

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference

URI
http://hdl.handle.net/10203/244160
Appears in Collection
ME-Conference Papers(학술회의논문)
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