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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

A Study on Mechanical properties of Thinned Single Crystal Silicon Wafer: Effect of Size and Direction

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Lee, Sangmin / Kim, Jae Han / Ohba, T / Kim, Y-S / Kim, Taek-Sooresearcher
Publisher
The Japan Institute of Electronics Packaging
Issue Date
2018-04-20
Language
English
Citation

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference

URI
http://hdl.handle.net/10203/244160
Appears in Collection
ME-Conference Papers(학술회의논문)
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