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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound

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Kim, Junmo / Song, Myoung / Gu, Chang-Yeon / Ma, Sung Woo / Jeong, Mu-Hyeon / Lee, Jin Hee / Lee, Woong-Sun / Kim, Taek-Sooresearcher
Publisher
IEEE
Issue Date
2023-03-08
Language
English
Citation

The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023

URI
http://hdl.handle.net/10203/317425
Appears in Collection
ME-Conference Papers(학술회의논문)
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