DSpace at KOASAS: Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate

DSpace at KOASAS

College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate

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Ko, Yongho / Kim, Taek-Soo researcher / Lee, Changwoo

Publisher: The Minerals, Metals & Materials Society(TMS)

Issue Date: 2014-02-16

Language: ENG

Citation: TMS 2014 143rd Annual Meeting

URI: http://hdl.handle.net/10203/187814

Appears in Collection: ME-Conference Papers(학술회의논문)

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