Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ko, Yongho | - |
| dc.contributor.author | Kim, Taek-Soo | - |
| dc.contributor.author | Lee, Changwoo | - |
| dc.date.accessioned | 2014-08-28T04:42:54Z | - |
| dc.date.available | 2014-08-28T04:42:54Z | - |
| dc.date.created | 2014-06-25 | - |
| dc.date.issued | 2014-02-16 | - |
| dc.identifier.citation | TMS 2014 143rd Annual Meeting, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/187814 | - |
| dc.language | ENG | - |
| dc.publisher | The Minerals, Metals & Materials Society(TMS) | - |
| dc.title | Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | TMS 2014 143rd Annual Meeting | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Ko, Yongho | - |
| dc.contributor.nonIdAuthor | Lee, Changwoo | - |
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