DSpace at KOASAS: Development of inclined conductive bump (ICB) for flip-chip interconnection

DSpace at KOASAS

College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Development of inclined conductive bump (ICB) for flip-chip interconnection

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Park A.-Y. / Kim S.-R. / Yoo C.D. / Kim, Taek-Soo researcher

Publisher: ECTC

Issue Date: 2011-05-31

Language: English

Citation: 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.880 - 885

ISSN: 0569-5503

URI: http://hdl.handle.net/10203/165889

Appears in Collection: ME-Conference Papers(학술회의논문)

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