Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Taek-Soo
Showing results 34 to 93 of 134
| Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, 2017 International Conference on Electronics Packaging, ICEP 2017, pp.566 - 567, Institute of Electrical and Electronics Engineers Inc., 2017-04-19 |
| Effect of Donor/Acceptor Blend Ratio and Molecular Weight of Polymer Acceptor on Fracture Behavior of All-Polymer Solar Cells Ma, Boo Soo; Lee, Jin-Woo; Kim, Bumjoon J.; Kim, Taek-Soo, International Conference on Materials and Reliability, The Korean Society of Mechanical Engineers, 2019-11-28 |
| Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ju, Min Sang; Kim, Taek-Soo, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, IEEE, 2023-06-02 |
| Effect of Moisture Absorption on the Warpage of Flexible Polymer Substrates Pyo, JB; Lee, TI; Kim, C; Kim, MS; Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Effect of the acceptor types on the fracture behavior of polymer solar cells Kim, Wansun; Choi, Joonhyeong; Kim, Jae-Han; Kim, Taesu; Lee, Changyeon; Lee, Seungjin; Kim, Mingoo; et al, 2018 20th International Conference on Electronic Materials and Packaging (EMAP), IEEE, 2018-12-19 |
| Effect of UV/Ozone Treatment on Interfacial Adhesion of Multilayer Graphene Seo, J; Kim, Taek-Soo, The 7th International Conference on Technological Advances of Thin Films & Surface Coatings, Thin Film Society, 2014-07-15 |
| Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environment Kim, Jihye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2319 - 2325, IEEE-CPMT, 2018-05-31 |
| Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2161 - 2167, IEEE-CPMT, 2017-06-01 |
| Effects of Hydrophobic Agent Content in Macro-Porous Substrates on the Fracture Behavior of the Gas Diffusion Layer for PEMFC Kim, S.; Jeong, B.-H.; Hong, B.K.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-16 |
| EFFICIENT, GREEN-SOLVENT PROCESSED, AND MECHANICALLY ROBUST POLYMER SOLAR CELLS ENABLED BY HYDROPHILIC SPACER-INCORPORATED POLYMER DONORS Lee, Seungjin; Lim, Chulhee; Lee, Jin-Woo; Lee, Sun-Woo; Jeon, Yeonji; Kim, Taek-Soo; Lee, Jung-Yong; et al, Global Photovoltaic Conference 2022, GPVC 2022, Korea Photovoltaic Society (KPVS), 2022-07-06 |
| Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics Oh, Seung Jin; Choi, Kyung Cheol; Kwon, Jeong Hyun; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Elucidating Thickness-Dependent Plane Stress Fracture Toughness of Ultra-Thin Nanocrystalline Gold Films Song, Myoung; Ma, Boo Soo; Oh, Seung Jin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition Oh, Seung Jin; Lee, Sun-Woo; Ham, Yeong Seok; Kwon, Jeong Hyun; Kim, Taek-Soo, The 14th International Symposium on NDT in Aerospace (AeroNDT2023), The Korean Society of Mechanical Engineers, 2023-11-08 |
| Enhancing Predictability of Thermal Warpage of Molded Wafer by Applying Accurate Thermo-Mechanical Properties of Epoxy Molding Compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sung Woo; Jeong, Mu-Hyeon; Lee, Jin Hee; Lee, Woong-Sun; et al, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
| Etching-Free Mechanical Transfer and Adhesion Measurement of Multilayer Graphene As-Grown on Nickel Kang, Sumin; Yoon, Taeshik; Kim, Taek-Soo, The 15th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2016-10-25 |
| Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate Ko, Yongho; Kim, Taek-Soo; Lee, Changwoo, TMS 2014 143rd Annual Meeting, The Minerals, Metals & Materials Society(TMS), 2014-02-16 |
| Evaluation on Property and Reliability of Micro-bump Joint between Si chip and Flexible Substrate Ko, Y.; Kim, M.; Kim, Taek-Soo; Bang, J.; Lee, C., 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging, 2013-10-06 |
| Experimental Verification of Through-Thickness Strain Distribution in Flexible Devices Under Bending Lee, Tae-Ik; Kim, Wansun; Jo, Woosung; Kim, Jihye; Paik, Kyung-Wook; Kim, Taek-Soo, 18th International Conference on Experimental Mechanics, European society for experimental mechanics, 2018-07-01 |
| Exploiting DMSO to Enhance Mechanical and Electrical Properties of PEDOT:PSS Conducting Polymer Films Lee, Inhwa; Kim, G.W; Yang, Min-Yang; Kim, Taek-Soo, Materials Research Society 2015 Spring Meeting, Materials Research Society, 2015-04-08 |
| Fabrication of Hydrogel-laden Paper Scaffolds for Tissue Regeneration Yu, Seung Jung; Kim, Suwhan; 이학래; Kim, Taek-Soo; 권성근; 황석연; Im, Sung Gap, 2016 춘계 한국생체재료학회, 한국생체재료학회, 2016-03-25 |
| Fabrication of Robust Freestanding Gold Membrane by Heat Treatment Kim, Dong Jun; Kim, Yong Hwi; Kim, Taek-Soo, Advanced Epitaxy for Freestanding Membranes and 2D Materials Conference, AEFM 2023, AEFM, 2023-07-10 |
| FE Analysis of Three-Layered Biomimetic Skin Pad for Prosthetic Hands Heo, Si-Hwan; Kim, Cheolgyu; Kim, Dong Hyun; Kim, Taek-Soo; Park, Hyung-Soon, 10th International Symposium on Nature-Inspired Technology, 대한기계학회, 2017-06-29 |
| FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, 2017 International Conference on Electronics Packaging, ICEP 2017, pp.422 - 423, Institute of Electrical and Electronics Engineers Inc., 2017-04-21 |
| Flexibility analysis of thin film encapsulation with structural variation Hyunjeong Shim; Kim, Cheolgyu; Kim, Bong Jun; Young-il Lee; Boo Soo Ma; Kim, Taek-Soo; Im, Sung Gap, IMID 2017, IMID 2017, 2017-08-31 |
| Flexible-linker embedded polymer donors enable superior blend miscibility for high-performance and mechanically-robust polymer solar cells Lee, Jin-Woo; Jung, Dahyun; Kim, Dong Jun; Kim, Taek-Soo; Kim, Bumjoon J., ACS Spring 2022, American Chemical Society, 2022-03-20 |
| Flexural Modulus Measurement and Warpage Analysis of Multilayers on Polymer Composite Substrates for Flexible Electronics Lee, TI; Kim, C; Kim, MS; Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Floating Transfer of Residual-Free Graphene using Water Surface J. Seo; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15 |
| Friction Controllable Tendon-Driving Actuation by Using Hygroscopic Deformation of Polymer Tube Lee, Kyoung-Soub; Pyo, Jae-Bum; Kim, Taek-Soo; Park, Hyung-Soon, The 3rd International Workshop on Active Materials and Soft Mechatronics, Active Materials and Soft Mechatronics, 2018-10-24 |
| Functionally Graded Hybrid Layers for High-Performance Polymer/Silicon Adhesion Kim, Taek-Soo; Giachino, M; N. Ananthakrishnan; S.M. Liff; R.H. Dauskardt, Materials Research Society 2011 Spring Meeting, Materials Research Society, 2011-04-25 |
| Graphene Electrode Architecture with Selective Defect Healing: Toward Flexible, Stretchable and Transparent Displays Park, Ick Joon; Kim, Tae In; Kang, Sumin; Yoon, Taeshik; Cho, Min-Sun; Kim, Taek-Soo; Choi, Sung-Yool, ICAMD 2017, ICAMD 2017, 2017-12-07 |
| High-Efficiency, Stable, Green-Solvent Processed Single-Component Organic Solar Cells Enables by Benzodithiophene-Based Conjugated Block Copolymer Phan, Tan Ngoc Lan; Lee, Jin-Woo; Oh, Eun Sung; Lee, Seungjin; Kim, Taek-Soo; Kim, Bumjoon J., Polyconcensation 2022, The Polymer Society of Korea, 2022-09-18 |
| High-performance organic solar cells enabled by sequentially fluorinated polythiophene donors Lee, Heung Goo; Lee, Jin-Woo; Oh, Eunsung; Lee, Sun Woo; Phan, Tan Ngoc-Lan; Li, Sheng; Kim, Taek-Soo; et al, Global Photovoltaic Conference, GPVC 2023, Korea Photovoltaic Society (KPVS), 2023-09-08 |
| Hydrogel-laden Paper Scaffolds for Origami-based Tissue Engineering Yu, Seung Jung; Kim, Suwhan; 이학래; Kim, Taek-Soo; 권성근; 황석연; Im, Sung Gap, 2015 MRS Fall Meeting & Exhibit, MRS(Materials Research Society), 2015-12-01 |
| Improving Defect Healing in Graphene by Enhanced Selective Electrochemical Deposition Cho, Minsun; Kang, Sumin; Kim, Taek-Soo, 2018 - Emerging Technologies in Mechanical Engineering, The Korean Society of Mechanical Engineers (KSME), 2018-08-21 |
| Interfacial adhesion and diffusion barrier characteristics of graphene layer Yoon, Taeshik; Kim, Taek-Soo, 67th IIW International Conference, IIW, 2014-07-17 |
| Interfacial adhesion and diffusion barrier characteristics of synthesized graphene Yoon, Taeshik; Cho, Byung Jin; Kim, Taek-Soo, 2014 The World Conference on Carbon, Carbon, 2014-07-03 |
| Intrinsically Stretchable, Green Solvent-Processed, and Efficient Polymer Solar Cells Enabled by Hydrophilic Flexible Spacer-Incorporating Polymer Donors Lim, Chulhee; Lee, Jin-Woo; Lee, Sun-Woo; Jeon, Yeonji; Kim, Taek-Soo; Lee, Jung-Yong; Kim, Bumjoon J., Polyconcensation 2022, The Polymer Society of Korea, 2022-09-18 |
| INTRINSICALLY-STRETCHABLE AND NON-HALOGENATED SOLVENT PROCESSED POLYMER SOLAR CELLS ENABLED BY HYDROPHILIC FLEXIBLE SPACER-INCORPORATING POLYMERS Lim, Chulhee; Lee, Jin-Woo; Lee, Sun Woo; Jeon, Yeonji; Lee, Seungjin; Kim, Taek-Soo; Lee, Jung-Yong; et al, 2023 MRS Spring Meeting & Exhibit, Materials Research Society (MRS), 2023-04-10 |
| Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes Lee, Sun Woo; Kim, Dong Jun; Jeon, Jinho; Yun, WonJun; Kim, Tae-Sung; Kim, Taek-Soo, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
| Joining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump Ko, Yong Ho; Kim, Taek-Soo; Bang, Jung-Hwan; Lee, Chang-Woo, 67th IIW International Conference, IIW, 2014-07-17 |
| Measurement of Adhesion and Mechanical Properties of Thin Films Kim, Taek-Soo, The Korean Microelectronics and Packaging Society 2015 Spring Meeting, 한국 마이크로 전자 및 패키징 학회, 2015-04-02 |
| Measurement of Equivalent Modulus of Chip Package Using Bending Test Kim, Hyeongjun; Lee, Tae-Ik; Park, Chun Myung; Park, Chang Kyu; Kim, Taek-Soo, The 17th International Symposium on Microelectronics and Packaging (ISMP2018), The Korean Microelectronics and Packaging Society, 2018-10-25 |
| Measurement of Mechanical Behavior of Pristine Fuel Cell Electrodes Using Water Surface Kim, Sanwi; Kim, Jae Han; Oh, Jong-Gil; Jang, Kyung-Lim; Jeong, Byeong-Heon; Hong, Bo Ki; Kim, Taek-Soo, 232nd ECS Meeting, The Electrochemical Society, 2017-10-04 |
| Measurement of Mechanical Properties of Advanced Ultra-Thin Films using Water surface Platform Kim, JH; Jang, KR; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-15 |
| Mechanical Behavior of Transparent Conducting Oxide Thin Films for Advanced Electronic Applications Oh, Seung Jin; Kwon, Jeong Hyun; Lee, Sangmin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Mechanical Properties of Advanced Thin Films for Energy Applications Kim, Taek-Soo, European Materials Research Society (E-MRS) Spring Meeting, European Materials Research Society, 2019-05-28 |
| Mechanical Properties of TEOS Thin Film Kim, Hyeong Jun; Kim, Dong Jun; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, JSME-CMD International Computational Mechanics Symposium, JSME-CMD, 2012-10-11 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 14th International Conference on Modern Materials and Technologies, The National Research Council of Italy, 2018-06-10 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 대한금속재료학회 2015년 춘계학술대회, 대한금속재료학회, 2015-04-23 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), International Conference on Electronic Packaging, 2015-04-16 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Mechanical Reliability of Cu/Low-k Interconnects and Underfill Yoon, Taeshik; Lee, Inhwa; Kim, Taek-Soo, IEEE International 3D System Integration Conference, IEEE, 2012-02-02 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, Korea-SV Electronics Packaging Technology Workshop, Korea-SV Electronics Packaging Technology Workshop, 2010-10-21 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, The 10th International Symposium on Microelectronics and Packaging, Korean Microelectronics and Packaging Society, 2011-10-12 |
| Mechanically Reliable Mechanism using Torsion Spring and Compliant Adhesive for Rollable Display Ma, Boo Soo; Kim, Taek-Soo, The 16th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2017-10-19 |
| Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate Kim, Cheolgyu; Lee, Tae-ik; Choi, Hyesun; Kim, Min-Sung; Kim, Taek-Soo, 64th Electronic Components and Technology Conference, pp.1004 - 1009, Electronic Components and Technology Conference(ECTC), 2014-05-29 |
| Moisture-Assisted Interfacial Crack Growth of SOFC Jang, K.-R.; Yoon, K.J.; Son, J.-W.; Kim, Taek-Soo, The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015, Nano Korea, 2015-07-01 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, Materials Research Society 2010 Spring Meeting, Materials Research Society, 2010-04-05 |
| Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films Kim, Taek-Soo; R.H. Dauskardt, 2010 NCCAVS CMPUG, NCCAVS CMPUG, 2010-04-28 |
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