DSpace at KOASAS: Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill

DSpace at KOASAS

College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill

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Kim, Taek-Soo researcher

Publisher: Korean Microelectronics and Packaging Society

Issue Date: 2011-10-12

Language: English

Citation: The 10th International Symposium on Microelectronics and Packaging

URI: http://hdl.handle.net/10203/259959

Appears in Collection: ME-Conference Papers(학술회의논문)

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