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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate

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Kim, Cheolgyu / Lee, Tae-ik / Choi, Hyesun / Kim, Min-Sung / Kim, Taek-Sooresearcher
Publisher
Electronic Components and Technology Conference(ECTC)
Issue Date
2014-05-29
Language
English
Citation

64th Electronic Components and Technology Conference, pp.1004 - 1009

DOI
10.1109/ECTC.2014.6897410
URI
http://hdl.handle.net/10203/187772
Appears in Collection
ME-Conference Papers(학술회의논문)
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