Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate

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Publisher
Electronic Components and Technology Conference(ECTC)
Issue Date
2014-05-29
Language
ENG
Citation

64th Electronic Components and Technology Conference, pp.1004 - 1009

DOI
10.1109/ECTC.2014.6897410
URI
http://hdl.handle.net/10203/187772
Appears in Collection
ME-Conference Papers(학술회의논문)
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