Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate

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dc.contributor.authorKim, Cheolgyuko
dc.contributor.authorLee, Tae-ikko
dc.contributor.authorChoi, Hyesunko
dc.contributor.authorKim, Min-Sungko
dc.contributor.authorKim, Taek-Sooko
dc.date.accessioned2014-08-28T02:50:52Z-
dc.date.available2014-08-28T02:50:52Z-
dc.date.created2014-06-25-
dc.date.created2014-06-25-
dc.date.created2014-06-25-
dc.date.issued2014-05-29-
dc.identifier.citation64th Electronic Components and Technology Conference, pp.1004 - 1009-
dc.identifier.urihttp://hdl.handle.net/10203/187772-
dc.languageEnglish-
dc.publisherElectronic Components and Technology Conference(ECTC)-
dc.titleMethodology Development of Warpage Analysis of Polymer Based Packaging Substrate-
dc.typeConference-
dc.identifier.wosid000361546100153-
dc.identifier.scopusid2-s2.0-84907886701-
dc.type.rimsCONF-
dc.citation.beginningpage1004-
dc.citation.endingpage1009-
dc.citation.publicationname64th Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.doi10.1109/ECTC.2014.6897410-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.nonIdAuthorKim, Cheolgyu-
dc.contributor.nonIdAuthorLee, Tae-ik-
dc.contributor.nonIdAuthorChoi, Hyesun-
dc.contributor.nonIdAuthorKim, Min-Sung-
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