DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Cheolgyu | ko |
dc.contributor.author | Lee, Tae-ik | ko |
dc.contributor.author | Choi, Hyesun | ko |
dc.contributor.author | Kim, Min-Sung | ko |
dc.contributor.author | Kim, Taek-Soo | ko |
dc.date.accessioned | 2014-08-28T02:50:52Z | - |
dc.date.available | 2014-08-28T02:50:52Z | - |
dc.date.created | 2014-06-25 | - |
dc.date.created | 2014-06-25 | - |
dc.date.created | 2014-06-25 | - |
dc.date.issued | 2014-05-29 | - |
dc.identifier.citation | 64th Electronic Components and Technology Conference, pp.1004 - 1009 | - |
dc.identifier.uri | http://hdl.handle.net/10203/187772 | - |
dc.language | English | - |
dc.publisher | Electronic Components and Technology Conference(ECTC) | - |
dc.title | Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate | - |
dc.type | Conference | - |
dc.identifier.wosid | 000361546100153 | - |
dc.identifier.scopusid | 2-s2.0-84907886701 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1004 | - |
dc.citation.endingpage | 1009 | - |
dc.citation.publicationname | 64th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.doi | 10.1109/ECTC.2014.6897410 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Taek-Soo | - |
dc.contributor.nonIdAuthor | Kim, Cheolgyu | - |
dc.contributor.nonIdAuthor | Lee, Tae-ik | - |
dc.contributor.nonIdAuthor | Choi, Hyesun | - |
dc.contributor.nonIdAuthor | Kim, Min-Sung | - |
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