Browse "MS-Journal Papers(저널논문)" by Type Article

Showing results 6481 to 6540 of 7246

6481
Theoretical calculation of electronic structure and X-ray absorption near-edge structure of cathode materials for Li ion batteries

Jeon, YA; Kim, YS; Kim, SK; No, Kwangsoo, SOLID STATE IONICS, v.177, pp.2661 - 2665, 2006-10

6482
Theoretical calibration of the composition of multicomponent thin film obtained by WDS

Lee, Won-Jong, KOREAN JOURNAL OF MATERIALS RESEARCH, v.7, no.7, pp.597 - 603, 1997-04

6483
Theoretical capacity achieved in a LiMn0.5Fe0.4Mg0.1BO3 cathode by using topological disorder

Kim, Jae Chul; Seo, Dong-Hwa; Ceder, Gerbrand, ENERGY & ENVIRONMENTAL SCIENCE, v.8, no.6, pp.1790 - 1798, 2015

6484
Theoretical composition calibration and thickness measurement in the analysis of multielement thin films using wavelength dispersive spectroscopy: application to PZT thin films

Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS, v.36, no.0, pp.1242 - 1245, 1997-04

6485
Theoretical Composition Calibration and Thickness Measurement in the Analysis of Multielement Thin Films Using Wavelength Dispersive Spectroscopy: Applications to Lead Zirconate Titanate Thin Films

Byun, Kyung-Mun; Kim, Jae-Whan; Lee, Won-Jong, Japanese Journal of Applied Physics, Vol.36, pp.L1242-L1245, 1997-09-15

6486
Theoretical evaluation of film growth rate during atomic layer epitaxy

Park, Hyung-Sang; Min, Jae-Sik; Lim, Jung-Wook; Kang, Sang-Won, APPLIED SURFACE SCIENCE, v.158, no.1-2, pp.81 - 91, 1999-12

6487
Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications

Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10

6488
Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition

Ahn, Ji-Hoon; Kwon, Se-Hun; Kim, Jin-Hyock; Kim, Ja-Yong; Kang, Sang-Won, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.26, no.4, pp.371 - 374, 2010-04

6489
Theoretical study of the ammonia nitridation rate on an Fe (100) surface: A combined density functional theory and kinetic Monte Carlo study

Yeo, Sang Chul; Lo, Yu Chieh; Li, Ju; Lee, Hyuck-Mo, JOURNAL OF CHEMICAL PHYSICS, v.141, no.13, pp.134108-1 - 134108-8, 2014-10

6490
Theoretical study on interaction of hydrogen with single-walled boron nitride nanotubes. II. Collision, storage, and adsorption

Han, SS; Kang, Jeung Ku; Lee, HyuckMo; van Duin, ACT; Goddard, WA, JOURNAL OF CHEMICAL PHYSICS, v.123, pp.4381 - 4396, 2005-09

6491
Theory, Synthesis, and Oxygen Reduction Catalysis of Fe-Porphyrin-Like Carbon Nanotube

Lee, Duck-Hyun; Lee, Won-Jun; Lee, Won-Jong; Kim, Sang-Ouk; Kim, Yong-Hyun, PHYSICAL REVIEW LETTERS, v.106, no.17, 2011-04

6492
Thermal Analysis of the Bi-Sr-Ca-Cu-O System by an Electrical Property

J.S. Park; Kim, Ho Gi, JOURNAL OF APPLIED PHYSICS, v.65, no.2, pp.877 - 879, 1989-01

6493
Thermal annealing effects on the photoluminescence of InGaN/GaN quantum wells

Lee, WH; Kim, KS; Yang, GM; Hong, CH; Lim, KY; Suh, EK; Lee, HJ; et al, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.39, no.1, pp.136 - 140, 2001-07

6494
Thermal Compatibility of Centrifugally Atomized U-Mo Powders with Al in a Dispersion Fuel

Paik, Kyung-Wook; Kim, Ki-Hwan; Lee, Don Bae; Kim, Chang Kyu; Hofman, GL, NUCLEAR ENGINEERING AND DESIGN, v.178, no.1, pp.111 - 117, 1997-12

6495
Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder

Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04

6496
Thermal Conductivity of AlN Ceramics

김도경, 요업기술, v.9, no.6, pp.621 - 629, 1994-06

6497
Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation

Kwon, WS; Yim, MJ; Paik, Kyung-Wook; Ham, SJ; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, pp.86 - 90, 2005-06

6498
Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 mu m pitch applications

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook, JOURNAL OF APPLIED PHYSICS, v.105, no.1, 2009-01

6499
Thermal design of a hydrogen storage system using La(Ce)Ni-5

Kim, Joong Bae; Han, Gwangwoo; Kwon, YongKeun; Bae, Joongmyeon; Cho, EunAe; Cho, SungBaek; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.45, no.15, pp.8742 - 8749, 2020-03

6500
Thermal dissolution mechanisms of AlN/CrN hard coating superlattices studied by atom probe tomography and transmission electron microscopy

Tytko, Darius; Choi, Pyuck-Pa; Raabe, Dierk, ACTA MATERIALIA, v.85, pp.32 - 41, 2015-02

6501
Thermal etching effects on InGaN/GaN and GaN/AlGaN quantum well structures during metalorganic chemical vapor deposition

Choi, SC; Song, YH; Jeon, SL; Jang, HJ; Yang, GM; Cho, HK; Lee, JeongYong, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.38, no.4, pp.413 - 415, 2001-04

6502
Thermal expansivity below 300K and low temperature heat capacity of YBa2Cu3O7

Swenson, CA; McCallum, RW; No, Kwangsoo, PHYSICAL REVIEW B, v.40, no.13, pp.8861 - 8871, 1989-11

6503
Thermal Properties of Carbon Nanotubes Reinforced Aluminum-Copper Matrix Nanocomposites

Nam, Dong Hoon; Cha, Seung Il; Lee, Kyung Moon; Jang, Jun Ho; Park, Hoon Mo; Lee, Jong Kook; Hong, Soon Hyung, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.16, no.11, pp.12013 - 12016, 2016-11

6504
Thermal Resistance of Cycloaliphatic Epoxy Hybrimer Based on Sol-Gel Derived Oligosiloxane for LED Encapsulation

Yang, Seung-Cheol; Kim, Joon-Soo; Jin, Jung-Ho; Kwak, Seung-Yeon; Bae, Byeong-Soo, JOURNAL OF APPLIED POLYMER SCIENCE, v.117, no.4, pp.2140 - 2145, 2010-08

6505
Thermal shock-stabilized metal catalysts on oxide hemitubes: Toward ultrasensitive chemiresistors

Chae, Soohwan; Ahn, Jaewan; Nam, Jong Seok; Jang, Ji-Soo; Kim, Il-Doo, APPLIED SURFACE SCIENCE, v.595, 2022-09

6506
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION

Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09

6507
Thermal stability and electrical properties of SrBi2Ta2-xNbxO9/IrOx capacitors with Pt top electrode

Kweon, SY; Choi, Si-Kyung; Yang, WS; Yeom, SJ; Roh, JS, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.9A, pp.5275 - 5280, 2001-09

6508
Thermal stability dependence on the stacking order and thickness ratio of the CoPt-TiO2/CoCrPt-SiO2 stacked media

Park, S. H.; Lee, Taek Dong; Kong, S. H.; Yoon, S. Y.; Lee, H. S.; Kim, H. J.; Oh, H. S., JOURNAL OF APPLIED PHYSICS, v.103, no.7, pp.07F528, 2008-04

6509
Thermal stability of electrodeposited nanocrystalline Co-1.1at.%P

Choi, Pyuck-Pa; da Silva, M; Klement, U; Al-Kassab, T; Kirchheim, R, ACTA MATERIALIA, v.53, no.16, pp.4473 - 4481, 2005-09

6510
Thermal stability of Fe-Mn binary olivine cathodes for Li rechargeable batteries

Kim, Jongsoon; Park, Kyu-Young; Park, Inchul; Yoo, Jung-Keun; Hong, Jihyun; Kang, Kisuk, JOURNAL OF MATERIALS CHEMISTRY, v.22, no.24, pp.11964 - 11970, 2012

6511
Thermal stability of fluorinated amorphous carbon thin films with low dielectric constant

Han, SS; Bae, Byeong-Soo, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.148, no.4, pp.67 - 72, 2001-04

6512
Thermal stability of nanocrystalline nickel-18 at.% tungsten alloy investigated with the tomographic atom probe

Choi, Pyuck-Pa; Al-Kassab, T; Gartner, F; Kreye, H; Kirchheim, R, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.353, no.1-2, pp.74 - 79, 2003-07

6513
Thermal stability of RuO2 thin films prepared by modified atomic layer deposition

Kim, Jin-Hyock; Ahn, Ji-Hoon; Kang, Sang-Won; Roh, Jae-Sung; Kwon, Se-Hun; Kim, Ja-Yong, CURRENT APPLIED PHYSICS, v.12, pp.S160 - S163, 2012-09

6514
Thermal stability of RuO2-based bottom electrodes during various ambient annealings

Ahn, JH; Park, JH; Choi, GP; Choi, WY; Kim, Ho Gi; Lee, WJ; Yoon, SG, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.S491 - S495, 1999-07

6515
Thermal stability of sol-gel derived methacrylate oligosiloxane-based hybrids for LED encapsulants

Kim, Joon-Soo; Yang, Seung-Cheol; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.53, pp.434 - 440, 2010-02

6516
Thermal stability of the exchanged biased CoFe/IrMn electrode for the magnetic tunnel junction as a function of CoFe thickness

Lee, JH; Kim, SJ; Yoon, CS; Kim, CK; Park, Byong Guk; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.92, no.10, pp.6241 - 6244, 2002-11

6517
Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography

Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05

6518
Thermal stability study of BaAl2Si2O8 : Eu2+ phosphor using its polymorphism for plasma display panel application

Im, WB; Kim, YI; Jeon, DukYoung, CHEMISTRY OF MATERIALS, v.18, no.5, pp.1190 - 1195, 2006-03

6519
Thermal-Wave imaging of Epocy Aluminum Interfaces

No, Kwangsoo; Mcclelland, JF, JOURNAL OF APPLIED PHYSICS, v.64, no.4, pp.1730 - 1735, 1988-08

6520
THERMAL-WAVE IMAGING OF VOIDS IN STRUCTURAL CERAMICS

No, Kwangsoo; Mcclelland, JF, JOURNAL OF APPLIED PHYSICS, v.64, no.5, pp.2801 - 2803, 1988-09

6521
Thermally controlled wettability of a nanoporous membrane grafted with catechol-tethered poly(N-isopropylacrylamide)

Kim, Jee Seon; Kim, Taek Gyung; Kong, Won Ho; Park, Tae Gwan; Nam, YoonSung, CHEMICAL COMMUNICATIONS, v.48, no.74, pp.9227 - 9229, 2012

6522
Thermally driven changes in the microstructure and mechanical properties of martensitic 15-5 precipitation-hardened stainless steel during directed energy deposition

Im, Hye Ji; Ryou, Kenhee; Kang, Tae Hyeok; Jimbo, Shotaro; Nambu, Shoichi; Han, Jeongho; Choi, Pyuck-Pa, ADDITIVE MANUFACTURING, v.74, 2023-07

6523
Thermally evaporated Cu2ZnSnS4 solar cells

Wang, K.; Gunawan, O.; Todorov, T.; Shin, B.; Chey, S. J.; Bojarczuk, N. A.; Mitzi, D.; et al, APPLIED PHYSICS LETTERS, v.97, no.14, 2010-10

6524
Thermally nitrided Cu-5.3Cr alloy for application as metallic separators in PEMFCs

Lee, Hye-Youn; Lee, Seok-Hyun; Kim, Jeong-Heon; Kim, Min-Chul; Wee, Dang-Moon, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.33, no.15, pp.4171 - 4177, 2008-08

6525
Thermally resistant UV-curable epoxy-siloxane hybrid materials for light emitting diode (LED) encapsulation

Yang, Seung-Cheol; Kwak, Seung-Yeon; Jin, Jung-Ho; Kim, Joon-Soo; Choi, Yong-Won; Paik, Kyung-Wook; Bae, Byeong-Soo, JOURNAL OF MATERIALS CHEMISTRY, v.22, no.18, pp.8874 - 8880, 2012

6526
Thermally stable optical characteristics of sol-gel hybrid material films

Moujoud, A; Kim, WS; Bae, Byeong-Soo; Shin, Sang Yung, APPLIED PHYSICS LETTERS, v.88, no.10, pp.228 - 236, 2006-03

6527
Thermally Stable Siloxane Hybrid Matrix with Low Dielectric Loss for Copper-Clad Laminates for High-Frequency Applications

Kim, Yongho; Lim, Young Woo; Kim, Yun Hyeok; Bae, Byeong-Soo, ACS APPLIED MATERIALS & INTERFACES, v.8, no.13, pp.8335 - 8340, 2016-04

6528
Thermally Stable Transparent Sol-Gel Based Siloxane Hybrid Material with High Refractive Index for Light Emitting Diode (LED) Encapsulation

Kim, Joon-Soo; Yang, Seung-Cheol; Bae, Byeong-Soo, CHEMISTRY OF MATERIALS, v.22, no.11, pp.3549 - 3555, 2010-06

6529
Thermally Stable, Dye-Bridged Nanohybrid-Based White Light-Emitting Diodes

Kwak, Seung-Yeon; Yang, Seung-Cheol; Kim, Na-Ree; Kim, Jae-Hong; Bae, Byeong-Soo, ADVANCED MATERIALS, v.23, no.48, pp.5767 - 5767, 2011-12

6530
Thermo-mechanical/thermal properties of photo-cationic polymerized cyclo-aliphatic epoxy hybrid materials

Yang, Seung-Cheol; Jin, Jung-Ho; Kwak, Seung-Yeon; Bae, Byeong-Soo, MACROMOLECULAR RESEARCH, v.19, no.11, pp.1166 - 1171, 2011-11

6531
Thermochemical production of sodium borohydride from sodium metaborate in a scaled-up reactor

Eom, Kwang-Sup; Cho, Eun-Ae; Kim, Min-Joong; Oh, Se-Kwon; Nam, Suk-Woo; Kwon, Hyuk-Sang, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.38, no.6, pp.2804 - 2809, 2013-02

6532
Thermochemical stability of IrO2 bottom electrodes in direct-liquid-injection metalorganic chemical vapor deposition of Pb(Zr,Ti)O-3 films

Byun, KM; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.43, no.5A, pp.2655 - 2660, 2004-05

6533
Thermodynamic and Kinetic Tuning of Block Copolymer Based on Random Copolymerization for High-Quality Sub-6 nm Pattern Formation

Hur, Yoon Hyung; Song, Seung Won; Kim, Jong Min; Park, Woon Ik; Kim, Kwang Ho; Kim, Yong Joo; Jung, Yeon Sik, ADVANCED FUNCTIONAL MATERIALS, v.28, no.28, 2018-07

6534
Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system

Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11

6535
Thermodynamic Assessment of the ZrO2-TiO2 System

김호기, THE KOREAN JOURNAL OF CERAMICS, v.7, no.1, pp.11 - 15, 2001-01

6536
Thermodynamic Calculation and Observation of Microstructural Change in Ni-Mo-Cr High Strength Low Alloy RPV Steels with Alloying Elements

Park, Sang Gyu; Kim, Min-Chul; Lee, Bong-Sang; Wee, Dang-Moon, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.46, no.12, pp.771 - 779, 2008-12

6537
Thermodynamic Calculation of Glass Forming Ranges in Al-Mg-Y and Al-Ni-Y ternary alloy systems

Kim, YG; Lee, HyuckMo, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.37, no.1, pp.50 - 56, 1999-01

6538
THERMODYNAMIC CONSIDERATIONS IN SUPERCONDUCTING OXIDES

Beyers, R; Ahn, Byung Tae, ANNUAL REVIEW OF MATERIALS SCIENCE, v.21, pp.335 - 372, 1991

6539
Thermodynamic equilibrium calculation of CU(s)-Cl-2(g) reaction

Kwon, MS; Lee, JeongYong, APPLIED SURFACE SCIENCE, v.207, pp.158 - 168, 2003-02

6540
THERMODYNAMIC EVALUATION AND PHASE-DIAGRAM OF PBO-TIO2 SYSTEM

Soh, JR; Lee, HyuckMo; Kwon, Hyuk-Sang, CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, v.18, no.3, pp.237 - 244, 1994-07

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