MS-Conference Papers(학술회의논문)
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Recent Items
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1
Machine Learning based Flexible Piezoelectric sensor
Lee, Keon Jae, Acoustics 2023, 2023-12-06
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2
Electric modulation of magnon spin transport in yttrium iron garnet thin films
Takayuki Shiino; Kim, Geunwoo; Phuock, Cao Van; Jeong, Jong-Ryul; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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3
Orbital Hall torques and magnetization switching of perpendicular magnetization
Shin, Soyoung; Lee, Soogil; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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4
Fast field-free spin-orbit torque switching in magnetic multilayer
Koh, Daekyu; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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5
Ultrafast spin dynamics of non-collinear antiferromagnet Mn3Sn driven by an optical spin-orbit torque
Lee, Won-Bin; Park, Byong-Guk; Lee, Kyung-Jin; Choi, Gyung-Min, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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6
Magnetic dynamics by exchange bias in the NiFe/IrMn double layers
Pi, Jinju; Seo, Seongbin; Park, Jungmin; Kim, Geunwoo; Park, Byong-Guk; Kim, Sanghoon, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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7
Generation of Probabilistic Bits by Exploiting Spin-Orbit Torque Switching in Magnetic Trilayer
Han, DongHyeon; Shin, Chaehyeon; Kim, Seok-Jong; Jang, Yunho; Lee, Geun-hee; Ryu, Jeongchun; Kohda, Makoto; Nitta, Junsaku; Kim, Kab-Jin; Park, Jongsun; Lee, Kyung-Jin; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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8
중엔트로피 초내열 합금의 기계적 특성 및 고온 강화기구 해석 연구
공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
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9
Plasmonic SERS Biosensor for Rapid and Accurate Bacterial Identification
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
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10
Hydrodynamically-Modulated Dewetting of Colloidal Solution for Physical Unclonable Functions
Cho, Yeongin; Pyeon, Jeongsu; Kim, Hyoungsoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-11-29
Collection's Items (Sorted by Submit Date in Descending order): 7281 to 7300 of 7321
| Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29 |
| Fabrication Process and Magnetostriction of Infiltrated Terfenol-D/Epoxy Composite Kwon, OY; Kim, HK; Yu, MK; Hong, Soon Hyung, Key Engineering Materials, Trans Tech Publications Ltd., 2007-03 |
| Spark Plasma Sintering Behavior of Nanocrystalline WC-10Co Cemented Carbide Powders Hong, Soon-Hyung, pp.0 - 0, Elsevier, 2002-06-01 |
| Exchange-bias of NiFe/NiO bilayer Noh, ES; Lee, Hyuck Mo, Materials Science Forum, v.475-479, pp.1 - 5, TRANS TECH PUBLICATIONS LTD, 2005-01 |
| Formation and characterization of cobalt-reinforced Sn-3.5Ag solder Lee, JS; Chu, KM; Jeon, Duk Young; Patzelt, R; Manessis, D; Ostmann, A, IEEE 56th Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2006-05-30 |
| Adhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish Kim, HJ; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1707 - 1713, IEEE, 2007-05-29 |
| Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs Paik, Kyung-Wook; Jeon, YD; Cho, MG, Proceedings - 54th Electronic Components and Technology Conference, pp.675 - 682, IEEE, 2004-06-01 |
| Non-Conductive Films (NCFs) with multi-functional epoxies and silica fillers for reliable NCFs Flip Chip on Organic Boards (FCOB) Chung, CK; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1831 - 1838, IEEE, 2007-05-29 |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
| Characteristics of fine patterned epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrates Hyun, JG; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1027 - 1032, IEEE, 2007-05-29 |
| Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 |
| A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates Jang, KW; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30 |
| Ultrasonic Anisotropic Conductive Films (ACFs) bonding of flexible substrates on organic rigid boards at room temperature Lee, K; Kim, HJ; Kim, I; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.480 - 486, IEEE, 2007-05-29 |
| Flip chip assembly on PCB substrates with coined solder bumps Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27 |
| Characterization of coined solder bumps on PCB pads Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, 52nd Electronic Components and Technology Conference, pp.154 - 160, IEEE, 2002-05-28 |
| Development of 3-dimensional memory die stack packages using polymer insulated sidewall technique Paik, Kyung-Wook, 49th Electronic Components and Technology Conference, pp.0, IEEE, 1999-06-01 |
| Study on the epoxy/BaTiO3 embedded capacitor films newly developed for PWB applications Cho, SD; Lee, JY; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.504 - 509, IEEE, 2002-05-28 |
| UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration Jang, SY; Wolf, J; Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1213 - 1220, IEEE, 2002-05-28 |
| Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs Jeon, YD; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208, IEEE, 2003-05-27 |
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Type
- 12 Article
- 1 Book
- 7,308 Conference
Date issued
- 691 2020 - 2023
- 2,574 2010 - 2019
- 2,236 2000 - 2009
- 1,492 1990 - 1999
- 318 1980 - 1989