Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs
- Publisher
- IEEE
- Issue Date
- 2004-06-01
- Language
- English
- Citation
Proceedings - 54th Electronic Components and Technology Conference, pp.675 - 682
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
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