UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration
- Publisher
- IEEE
- Issue Date
- 2002-05-28
- Language
- English
- Citation
52nd Electronic Components and Technology Conference, pp.1213 - 1220
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
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