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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration

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dc.contributor.authorJang, SYko
dc.contributor.authorWolf, Jko
dc.contributor.authorKwon, WSko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-11T05:49:23Z-
dc.date.available2007-09-11T05:49:23Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-05-28-
dc.identifier.citation52nd Electronic Components and Technology Conference, pp.1213 - 1220-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1403-
dc.description.sponsorshipThe authors would like to express sincere appreciations to Herbert Reichl (Fraunhofer IZM) for the support of KAISTFraunhofer IZM co-work program. Special thanks to Hans Auer and Heinz Gloor (Unaxis Balzers) for the UBM depostion and to J.H.Lee (Daeduck Electronics) for providing test substrates. They also thank to J.H.Kim and H. Ezawa (Toshiba) for helpful technical advising. This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleUBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration-
dc.typeConference-
dc.identifier.wosid000176683800198-
dc.identifier.scopusid2-s2.0-0036292985-
dc.type.rimsCONF-
dc.citation.beginningpage1213-
dc.citation.endingpage1220-
dc.citation.publicationname52nd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJang, SY-
dc.contributor.nonIdAuthorWolf, J-
dc.contributor.nonIdAuthorKwon, WS-
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