DSpace at KOASAS: High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications

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Yim, MJ / Hwang, JS / Kwon, WS / Jang, KW / Paik, Kyung-Wook researcher

Publisher: 2002 Electronic Components & Technology Conference

Issue Date: 2002-05-28

Language: ENG

Citation: 2002 Electronic Components & Technology Conference , pp.1385 - 1389

URI: http://hdl.handle.net/10203/1413

Appears in Collection: MS-Conference Papers(학술회의논문)

Files in This Item: FC_72.pdf(1.4 MB)Download

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