Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jeon, YD
Showing results 1 to 16 of 16
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| Applications of Ni and Cu electroless plating techniques for flip chip bumping and under bump metallurgy (UBM) Paik, Kyung-Wook; Jeon, YD; Nah, JW, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.177 - 184, 2001-07-08 |
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 |
| Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs Jeon, YD; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208, IEEE, 2003-05-27 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13 |
| Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs Paik, Kyung-Wook; Jeon, YD; Cho, MG, Proceedings - 54th Electronic Components and Technology Conference, pp.675 - 682, IEEE, 2004-06-01 |
| Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 |
| Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
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