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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

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Jeon, YD / Nieland, S / Ostmann, A / Reichl, H / Paik, Kyung-Wookresearcher
Publisher
IEEE
Issue Date
2002-05-28
Language
English
Citation

52nd Electronic Components and Technology Conference, pp.740 - 746

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1296
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MS-Conference Papers(학술회의논문)
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