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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

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dc.contributor.authorJeon, YDko
dc.contributor.authorNieland, Sko
dc.contributor.authorOstmann, Ako
dc.contributor.authorReichl, Hko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2007-09-04T09:00:08Z-
dc.date.available2007-09-04T09:00:08Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2002-05-28-
dc.identifier.citation52nd Electronic Components and Technology Conference, pp.740 - 746-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/1296-
dc.description.sponsorship"This work was supported by Center for Electronic Packaging Materials of Korea Science and Engineering Foundation."en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleStudies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy-
dc.typeConference-
dc.identifier.wosid000176683800117-
dc.identifier.scopusid2-s2.0-0036290937-
dc.type.rimsCONF-
dc.citation.beginningpage740-
dc.citation.endingpage746-
dc.citation.publicationname52nd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorJeon, YD-
dc.contributor.nonIdAuthorNieland, S-
dc.contributor.nonIdAuthorOstmann, A-
dc.contributor.nonIdAuthorReichl, H-
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