Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability
- Publisher
- IEEE
- Issue Date
- 2001-05-29
- Language
- ENG
- Citation
51st Electronic Components and Technology Conference, pp.1326 - 1332
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- FC_52.pdf(1.15 MB)Download
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