Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Cited 37 time in webofscience Cited 43 time in scopus
  • Hit : 266
  • Download : 0
A study on the electroless-deposited Ni-P under bump metallurgy (UBM) was performed for the fabrication of flip chip bumps. The interfacial reaction at the electroless Ni UBM/solder interface was investigated. The growth kinetics of the Ni-Sn intermetallic compounds (IMC) showed a rapid initial growth, followed by a reduced growth and a diffusion-controlled growth. Shear testing showed that the Ni UBM-Sn containing solder systems caused brittle bump failure, resulting in decreased bump adhesion strength.
Publisher
Institute of Electrical and Electronics Engineers
Issue Date
2002-05
Language
English
Article Type
Article; Proceedings Paper
Keywords

NI-P; KINETICS

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528

ISSN
0361-5235
DOI
10.1007/s11664-002-0109-4
URI
http://hdl.handle.net/10203/80944
Appears in Collection
MS-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 37 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0