Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 36801 to 36820 of 51017
| Three Dimensional Marker-Driven Watershed Transform for Volume and Intensity Measurement from Medical Images: Preliminary Results Kim, Desok; Chae, Yong-su, International Conference on Hybrid Information Technology(ICHIT 2006), ICHIT, 2006-11-09 |
| Three dimensional surface representation by polygonal volume primitives = 다면체원소에 의한 삼차원 표면의 모형화link Yun, Hee-Jong; 윤희종; et al, 한국과학기술원, 1992 |
| Three dimensional ultrashort echo time (UTE) MRI for meniscus enhancement = 반월상 연골판 강조 영상을 위한 삼차원 초단 에코 시간 자기 공명 영상 기법link Min, Kyung Tak; Park, Hyun Wook; et al, 한국과학기술원, 2018 |
| Three dimensional volume measurement of mouse abdominal fat in magnetic resonance images Chae, Yong-su; Jeong, Myeong Gi; Kim, Desok, HEALTHCOM 2007: Ubiquitous Health in Aging Societies - 2007 9th International Conference on e-Health Networking, Application and Services, pp.252 - 255, 2007-06-19 |
| Three integer multiplication based complex constant multiplier for multipath pipelined 128-point FFT processors = 다중경로의 파이프라인 128 포인트 FFT 프로세서를 위한 3개의 곱셈 기반 복소수 상수 곱셈기link Lin, Hua; LinHua; et al, 한국과학기술원, 2014 |
| Three Phase Diode Rectifier Employing Soft Switching Methods Moon, Gun Woo; Lee, Jung Hoon; Youn, Myung Joong, '93 KIEE Summer Conference, pp.847 - 849, KIEE, 1993-07 |
| Three Phase Resonant Pole Inverter Using a New Sepa Sated Soft Switching Resonant Pole J.G.Cho; D.Y.Hu; G.H.Cho, 전기학회논문지, v.4, no.2, pp.90 - 97, 1991 |
| Three Phase Sine Wave voltage Source Inverter Using the Soft Switched Resonant Poles Cho, Gyu-Hyeong, pp.48 - 53, IEEE, 1989-11 |
| Three phase three-level PWM switched voltage source inverter with zero neutral point potential Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWoo, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.21, no.5, pp.1320 - 1326, 2006-09 |
| Three phase three-level PWM switched voltage source inverter with zero neutral point potential Oh, Won-Sik; Han, Sang-Kyoo; Choi, Seong-Wook; Moon, GunWoo, Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual (Volume:6 ), pp.4405 - 4410, IEEE, 2004-06-20 |
| Three- dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same Yoon, Jun-Bo; Yoon, Euisik; Kim, Choong-Ki; Han, Chul-Hi, 2004-06-03 |
| Three-axes radiating millimeter-wave antenna-in-package design for mobile devices = 모바일 기기를 위한 밀리미터파 대역 3축 방사 안테나 인 패키지 설계link Kim, Hong-Yi; Park, Chul Soon; et al, 한국과학기술원, 2021 |
| THREE-DIMENSIONAL (3-D) RESHAPING TECHNIQUE IN MEMS DEVICES BY SOLELY ELECTRICAL CONTROL WITH ULTRAFINE TUNING RESOLUTION Yoon, Yong-Hoon; Han, Chang-Hoon; Yoon, Jun-Bo, The 27th IEEE International Conference on Micro electro Mechanical System, MEMS 2014, pp.660 - 663, IEEE, 2014-01-30 |
| Three-Dimensional Blood Vessel Quantification via Centerline Deformation Kang, Dong-Goo; Suh, Dae Chul; Ra, Jong Beom, IEEE TRANSACTIONS ON MEDICAL IMAGING, v.28, pp.405 - 414, 2009-03 |
| Three-dimensional electro-floating display system using an integral imaging method Min, SW; Hahn, Minsoo; Kim, J; Lee, B, OPTICS EXPRESS, v.13, pp.4358 - 4369, 2005-06 |
| Three-Dimensional Fin-Structured Semiconducting Carbon Nanotube Network Transistor Lee, Dong-Il; Lee, Byung-Hyun; Yoon, Jinsu; Ahn, Dae-Chul; Park, Jun-Young; Hur, Jae; Kim, Myung-Su; et al, ACS NANO, v.10, no.12, pp.10894 - 10900, 2016-12 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network Shin, Changyeop; Ryu, Hyun; Cho, Eun-Seo; Han, Seungjae; Lee, Kang-Han; Kim, Cheol-Hee; Yoon, Young-Gyu, MEDICAL IMAGE ANALYSIS, v.82, 2022-11 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network = 3차원 형광영상 복원을 위한 딥러닝 기반 가상 재초점 기술 연구link Shin, Changyeop; Yoon, Young-Gyu; et al, 한국과학기술원, 2022 |
| Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
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