The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

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Publisher
IEEE
Issue Date
2005-05-31
Language
ENG
Citation

55th Electronic Components and Technology Conference, ECTC, v.2, pp.1468 - 1474

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1238
Appears in Collection
MS-Conference Papers(학술회의논문)
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