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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

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Kwon, WS / Yang, SY / Lee, Soon-Bokresearcher / Paik, Kyung-Wookresearcher
Publisher
IEEE
Issue Date
2004-06-01
Language
English
Citation

Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1231
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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