DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kwon, WS | ko |
dc.contributor.author | Yang, SY | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-03T06:02:38Z | - |
dc.date.available | 2007-09-03T06:02:38Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-06-01 | - |
dc.identifier.citation | Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1231 | - |
dc.description.sponsorship | This work was supported by the Center for Electronic Packaging Materials of the Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling | - |
dc.type | Conference | - |
dc.identifier.wosid | 000224340900274 | - |
dc.identifier.scopusid | 2-s2.0-10444278084 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1731 | - |
dc.citation.endingpage | 1737 | - |
dc.citation.publicationname | Proceedings - 54th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Las Vegas, NV | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kwon, WS | - |
dc.contributor.nonIdAuthor | Yang, SY | - |
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