In this paper, the high frequency properties of anisotropic conductive films (ACFs) in flip chip interconnects at the RF and high-frequency range were investigated. To evaluate the high frequency model parameters, which are based on an ACF flip chip model and a network analysis, high-frequency measurements of test flip chip vehicles that used different bonding materials were evaluated. Furthermore, to demonstrate real applications for an ACF interconnection at the RF and high-frequency range, ACF flip chip technologies were applied to assemble a passive device that uses an RF integrated passive device, and also, an active device that uses a highly integrated monolithic microwave integrated circuit device on an RF module. Furthermore, the high-frequency characteristics of these devices with those of flip chip assemblies fabricated via conventional methods such as solder ball interconnection were compared.