High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application

Abstract

In this paper, the high frequency properties of anisotropic conductive films (ACFs) in flip chip interconnects at the RF and high-frequency range were investigated. To evaluate the high frequency model parameters, which are based on an ACF flip chip model and a network analysis, high-frequency measurements of test flip chip vehicles that used different bonding materials were evaluated. Furthermore, to demonstrate real applications for an ACF interconnection at the RF and high-frequency range, ACF flip chip technologies were applied to assemble a passive device that uses an RF integrated passive device, and also, an active device that uses a highly integrated monolithic microwave integrated circuit device on an RF module. Furthermore, the high-frequency characteristics of these devices with those of flip chip assemblies fabricated via conventional methods such as solder ball interconnection were compared.