Effect of Non-conducting filler additions on Anisotropic Conductive Adhesive(ACAs) properties and reliability of ACAs flip-chip on organic substrates

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Publisher
한국재료학회
Issue Date
2000-03
Language
Korean
Citation

한국재료학회지, v.10, no.3, pp.184 - 190

ISSN
1225-0562
URI
http://hdl.handle.net/10203/69533
Appears in Collection
MS-Journal Papers(저널논문)
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