Effect of Non-conducting filler additions on Anisotropic Conductive Adhesive(ACAs) properties and reliability of ACAs flip-chip on organic substrates

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dc.contributor.author백경욱ko
dc.date.accessioned2013-02-27T16:13:39Z-
dc.date.available2013-02-27T16:13:39Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2000-03-
dc.identifier.citation한국재료학회지, v.10, no.3, pp.184 - 190-
dc.identifier.issn1225-0562-
dc.identifier.urihttp://hdl.handle.net/10203/69533-
dc.languageKorean-
dc.publisher한국재료학회-
dc.titleEffect of Non-conducting filler additions on Anisotropic Conductive Adhesive(ACAs) properties and reliability of ACAs flip-chip on organic substrates-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume10-
dc.citation.issue3-
dc.citation.beginningpage184-
dc.citation.endingpage190-
dc.citation.publicationname한국재료학회지-
dc.contributor.localauthor백경욱-
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