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Results 1-10 of 10 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
The Encapsulation of EL Materials Photo-Patterning using β-cyclodextrin

Park, Ji Young; Kim, Jin-Baek, SPIE-The International Society for Optical Engineering, pp.0 - 0, SPIE, 2005-02-27

2
Bilayer Resists Based on Polyhedral Oligomeric Silsesquioxane for Deep-UV Lithography

Ganesan, Ramakrishnan; Kim, Jin-Baek, Korea-Japan Young Scientist Symposium on polymers, 2005, pp.0 - 0, JSPS, KOSEF, 2005-09-30

3
Nanomolecular resist with adamantane core for 193-nm lithography

Kim, Jin-Baek, 2005 CHemistry Symposium of Kaist-KYOTO University, pp.0 - 0, 2005-02

4
Synthesis of copolymers containing diazoketo groups and their application as DUV resists

Kim, Jin-Baek; Kim, Kyoung-Seon, Advances in Resist Technology and Processing XXII, v.5753, pp.1057 - 1065, 2005-02-28

5
Encapsulation of light emitting materials and photo-patterning using 棺-cyclodextrin

Kim, Jin-Baek; Park, Ji Young, Advances in Resist Technology and Processing XXII, v.5753, pp.932 - 938, 2005-02-28

6
Synthesis of copolymers containing diazoketo groups and their application as DUV resists

Kim, Jin-Baek; Kim, Kyoung-Seon, Progr. Biomed. Opt. Imaging Proc. SPIE, v.5753, pp.1057 - 1065, SPIE, 2005

7
Molecular resist with adamantane core for 193-nm lithography

Kim, Jin-Baek, 제7회 BK21 분자과학사업단 심포지움, pp.0 - 0, KAIST-성균관대 분자과학사업단, 2005-02-01

8
Photo-crosslinkable materials for Organic Light Emitting Diode

Park, Jiyoung; Kim, Jin-Baek, Korea-Japan young scientist symposium on polymers, pp.0 - 0, JSPS, KOSEF, 2005-09-30

9
Bilayer Resists Based on Polyhedral Oligomeric Silsesquioxane for 193-nm Lithography

Ganesan, Ramakrishnan; Choi, Jae-Hak; Kim, Kyoung-Seon; Oh, Tae-Hwan; Yun, Hyo-Jin; Kwon, Young-Gil; Kim, Jin-Baek, SPIE-The International Society for Optical Engineering, pp.0, SPIE, 2005-02-27

10
Nanomolecular resists with adamantane core for 193-nm lithography

Kim, Jin-Baek; Oh, Tae-Hwan; Kim, Jin-Baek, Advances in Resist Technology and Processing XXII, pp.603 - 610, SPIE, 2005-02-28

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