MS-Conference Papers(학술회의논문)
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Recent Items
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1
Machine Learning based Flexible Piezoelectric sensor
Lee, Keon Jae, Acoustics 2023, 2023-12-06
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2
Electric modulation of magnon spin transport in yttrium iron garnet thin films
Takayuki Shiino; Kim, Geunwoo; Phuock, Cao Van; Jeong, Jong-Ryul; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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3
Orbital Hall torques and magnetization switching of perpendicular magnetization
Shin, Soyoung; Lee, Soogil; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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4
Fast field-free spin-orbit torque switching in magnetic multilayer
Koh, Daekyu; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-05
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5
Ultrafast spin dynamics of non-collinear antiferromagnet Mn3Sn driven by an optical spin-orbit torque
Lee, Won-Bin; Park, Byong-Guk; Lee, Kyung-Jin; Choi, Gyung-Min, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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6
Magnetic dynamics by exchange bias in the NiFe/IrMn double layers
Pi, Jinju; Seo, Seongbin; Park, Jungmin; Kim, Geunwoo; Park, Byong-Guk; Kim, Sanghoon, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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7
Generation of Probabilistic Bits by Exploiting Spin-Orbit Torque Switching in Magnetic Trilayer
Han, DongHyeon; Shin, Chaehyeon; Kim, Seok-Jong; Jang, Yunho; Lee, Geun-hee; Ryu, Jeongchun; Kohda, Makoto; Nitta, Junsaku; Kim, Kab-Jin; Park, Jongsun; Lee, Kyung-Jin; Park, Byong-Guk, The 13th International Conference on Advanced Materials and Devices (ICAMD2023), 2023-12-04
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8
중엔트로피 초내열 합금의 기계적 특성 및 고온 강화기구 해석 연구
공태영; 류호진; 홍순형, 한국분말재료학회 2023 추계학술발표회, 2023-12-01
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9
Plasmonic SERS Biosensor for Rapid and Accurate Bacterial Identification
Ko, JiWoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-12-01
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10
Hydrodynamically-Modulated Dewetting of Colloidal Solution for Physical Unclonable Functions
Cho, Yeongin; Pyeon, Jeongsu; Kim, Hyoungsoo; Jung, Yeon Sik, 2023 MRS Fall Meeting & Exhibit, 2023-11-29
Collection's Items (Sorted by Submit Date in Descending order): 7301 to 7320 of 7321
| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29 |
| Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29 |
| Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems Jang, Se-Young; Paik, Kyung-Wook, 50th Electronic Components and Technology Conference, pp.64 - 68, IEEE, 2000-05-01 |
| The multilayer-modified Stoney’s formula for laminated polymer composites on a silicon substrate Kim, Jin S.; Paik, Kyung W.; Oh, Seung H.; Kim, Y.K., JOURNAL OF APPLIED PHYSICS, VOLUME 86, NUMBER 10, pp.5474-5479, 1998-05-25 |
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
| High current induced failure of ACAs flip chip joint Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1130 - 1134, IEEE, 2002-05-28 |
| The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31 |
| Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31 |
| Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30 |
| The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01 |
| Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 |
| Frequency and temperature dependence of dielectric constant of epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs) for organic substrate Hyun, JG; Lee, S; Cho, SD; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1241 - 1247, IEEE, 2005-05-31 |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 |
| Frequency behavior of embedded epoxy/SrTiO3 composite capacitor materials Lee, S; Hyun, JG; Park, H; Kim, Joungho; Paik, Kyung-Wook, The 55th Electronic Components and Technology Conference, ECTC, pp.1222 - 1227, IEEE, 2005-05-31 |
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Date issued
- 691 2020 - 2023
- 2,574 2010 - 2019
- 2,236 2000 - 2009
- 1,492 1990 - 1999
- 318 1980 - 1989