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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

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Son, HY / Chung, CK / Yim, MJ / Paik, Kyung-Wookresearcher
Publisher
IEEE
Issue Date
2006-05-30
Language
English
Citation

IEEE 56th Electronic Components and Technology Conference, pp.565 - 569

URI
http://hdl.handle.net/10203/1226
Appears in Collection
MS-Conference Papers(학술회의논문)
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