DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, HY | ko |
dc.contributor.author | Chung, CK | ko |
dc.contributor.author | Yim, MJ | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-03T05:44:23Z | - |
dc.date.available | 2007-09-03T05:44:23Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-05-30 | - |
dc.identifier.citation | IEEE 56th Electronic Components and Technology Conference, pp.565 - 569 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1226 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections | - |
dc.type | Conference | - |
dc.identifier.wosid | 000238566600088 | - |
dc.identifier.scopusid | 2-s2.0-33845589842 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 565 | - |
dc.citation.endingpage | 569 | - |
dc.citation.publicationname | IEEE 56th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Diego, CA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Chung, CK | - |
dc.contributor.nonIdAuthor | Yim, MJ | - |
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