MS-Conference Papers(학술회의논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 5341 to 5360 of 7321

5341
In-situ plasma diagnosis of chemical species in microwave plasma-assisted chemical vapour deposition for the growth of carbon nanotubes using CH4/H2/NH3 gases

Woo, YS; Han, IT; Lee, NS; Jung, JE; Jeon, Duk Young; Kim, JM, Electron-Emissive Materials, Vacuum Microelectronics and Flat-Panel Displays, v.621, 2000-04-25

5342
Intrinsic stress measurements in CVD diamond films

Yu, Jin; Kim, JG; Sohn, YC; Lee, YS, Symposium-Amorphous and Nanoestructured Carbon, pp.471 - 476, MRS, 1999-11-29

5343
Damage to brittle coating layer with compliant substrate from concentrated loads

Lee C.-S.; Kim J.-H.; Kim, Do Kyung, Advanced Ceramics and Composites, v.247, pp.287 - 292, 2002-11-19

5344
In2O3 가 코팅된 ZnGa2O4:Mn 형광체의 발광증가 및 In2O3 의 표면 분포에 관한 연구

Jeon, Duk Young, Field Emission Workshop, pp.117 -, 1999-07-29

5345
In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition

Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06

5346
In-situ growth and growth kinetics of epitaxial (100) CoSi2 layer on (100) Si by reactive chemical vapor deposition

Rhee, Hwa Sung; Lee, Heui Seung; Park, Jong Ho; Ahn, Byung Tae, Gate Stack and Silicide Issues in Silicon Processing, v.611, pp.0 - 0, 2000-04-25

5347
A Study on the Effects of Anion Additives on the Initiation and Growth of the Pit Formed on Pure Aluminium in Chloride-Containing Solution

변수일, The Korean Electrochemical Society, pp.42 - 42, 1999

5348
A Study on the Effect of Solution Temperature on Inconel 600 Passivity in Thiosulfate Solution by Using Ac-impedance Spectroscopy

변수일, The Korean Electrochemical Society, pp.44 - 44, 1999

5349
Strain-induced diffusion in strained SiGe/Si heterostructures

Lim, YS; Lee, Jeong Yong; Kim, HS; Moon, DW, Growth, Evolution and Properties of Surfaces, Thin Films and Self-Organized Strutures, v.648, pp.369 - 370, 2000-11-27

5350
Novel Anistropic Conductive Adhesives Flip Chip on Organic Substrates For High Frequency Applications

Paik, Kyung-Wook; Yim, MJ; Kwon,WS, Proceeding of 2001 Korea-Japan Joint Workshop on Advanced semiconductor Processes and Equipments, pp.0 - 0, 2001-05-01

5351
SnO2:Eu 형광체의 저전압 발광 특성 연구

전덕영, 한국 세라믹 학회 춘계학술대회, pp.162 -, 한국 세라믹학회, 2001-01-01

5352
Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump

Paik, Kyung-Wook, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01

5353
The Kinetics of Lithium Transport through a Hard Carbon Electrode Studied by Analysis of Current Transients

Pyun, Su Il, International Meeting on Lithium Batteries, 2002

5354
Novel simulation model for perpendicular magnetic recording

Lee K.J.; Im Y.H.; Kim Y.S.; Lee K.M.; Kim J.W.; Park N.Y.; Park G.S.; et al, Proceedings of the 5th Perpendicular Magnetic Recording Conference (PMRC 2000), v.235, no.40546, pp.398 - 402, 2000-10-23

5355
Stability and read/write characteristics of nano ferroelectric domains

No, Kwangsoo; Song, HW; Hong, J; Woo, J; Shin, H; Hong, S, 3rd Asian Meeting on Ferroelectrics, AMF-3, v.259, no.1, pp.289 - 298, 2002-12-13

5356
Step-like energy barrier variations of high Ku material

Lee K.J.; Lee, Taek Dong; Park N.Y., 2002 IEEE International Magnetics Conference-2002 IEEE INTERMAG, 2002-04-28

5357
Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates

Paik, Kyung-Wook; Jang, SY, Pan Pacific Microelectronics Symposium, pp.173 - 179, 1999-02-01

5358
Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films

Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, 12th Interntional Symposium on Integrated Ferroelectrics, v.35, no.40547, 2000-03-12

5359
Titanium Dioxide Films Grown by Plasma-Enhanced Atomic Layer Deposition

KANG SANG WON, 3rd International AVS Conference on Microelectronics and Interfaces, 2002-01-01

5360
The effect of Cd and Sn on the fluidity and casting properties in high strength Al-Cu alloy

이진형, 대한금속재료학회, 2000

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