Study on the Under Bump Metallutgy(UBM) for electro-plated Eutectic Pb/Sn Soder Bumps on Organic Substrates
- Issue Date
- 1999-02-01
- Language
- ENG
- Citation
Pan Pacific Microelectronics Symposium, pp.173 - 179
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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